In the last decade wireless communications engineering has seen outstanding progress, making merged, enhanced and novel applications in the area of mobile phones, wireless networks, sensors and television feasible. Technologies have developed from hybrid systems to highly integrated solutions in silicon, SiGe, GaAs and InP. By aggressive scaling of device dimensions below 0. 1 ?m and employing advanced technologies such as SOI, strained silicon and low-k, circuits with operation frequencies and bandwidths up to approximately 100 GHz can now be fabricated. However, especially in silicon, the...

In the last decade wireless communications engineering has seen outstanding progress, making merged, enhanced and novel applications in the area of mobile phones, wireless networks, sensors and television feasible. Technologies have developed from hybrid systems to highly integrated solutions in silicon, SiGe, GaAs and InP. By aggressive scaling of device dimensions below 0. 1 ?m and employing advanced technologies such as SOI, strained silicon and low-k, circuits with operation frequencies and bandwidths up to approximately 100 GHz can now be fabricated. However, especially in silicon, the...