Provides the first treatment in English dedicated to lapping and polishing technologies and processes Examines lapping of brittle and ductile materials and includes a special chapter on lapping equipment Covers polishing and CMP in detail Presents the latest technologies illustrated by case studies Reflects the experience of leading experts from Japan, Germany, and the US Lapping and polishing are the most precise processes used to finish the surfaces of mechanical and electronics/semiconductor components. The Handbook of Lapping and Polishing is the first book written in English to...