Modern science and technology, from materials science to integrated circuit development, is directed toward the nanoscale. From thin films to field effect transistors, the emphasis is on reducing dimensions from the micro to the nanoscale. Fundamentals of Nanoscale Film Analysis concentrates on analysis of the structure and composition of the surface and the outer few tens to hundred nanometers in depth. It describes characterization techniques to quantify the structure, composition and depth distribution of materials with the use of energetic particles...

Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as an interconnect metal. The authors provide details on a wide range of experimental, characterization, and analysis...

Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as an interconnect metal. The authors provide details on a wide range of experimental, characterization, and analysis...