This book addresses what is needed in future applications in order to avoid latchup in advanced technologies. A significant amount of new latchup issues and materials from the last twenty years are presented, such as the development of external and transient latchup concepts, and new tools such as the PICA tool.

This volume is the first in a series of three books addressing Electrostatic Discharge (ESD) physics, devices, circuits and design across the full range of integrated circuit technologies. ESD Physics and Devices provides a concise treatment of the ESD phenomenon and the physics of devices operating under ESD conditions. Voldman presents an accessible introduction to the field for engineers and researchers requiring a solid grounding in this important area. The book contains advanced CMOS, Silicon On Insulator, Silicon Germanium, and Silicon Germanium Carbon. In addition it also...