Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI...
Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need ...
Increased demand for and developments in micromanufacturing have created a need for a resource that covers both the science and technology of this rapidly growing area. With contributions from eminent professors and researchers actively engaged in teaching, research, and development, Micromanufacturing Processes details the basic principles, tools, techniques, and latest advances in micromanufacturing processes. It includes coverage of measurement techniques and research trends as well as a large number of cross-references, making it useful to the students and researchers alike.
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Increased demand for and developments in micromanufacturing have created a need for a resource that covers both the science and technology of this ...
Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI...
Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need ...
This book provides an in-depth understanding of free space optical (FSO) communication with a particular emphasis on optical beam propagation through atmospheric turbulence. The book is structured in such a way that it provides a basic framework for the beginners and also gives a concise description from a designer s perspective. The book provides an exposure to FSO technology, fundamental limitations, design methodologies, system trade-offs, acquisition, tracking and pointing (ATP) techniques and link-feasibility analysis. The contents of this book will be of interest to professionals and...
This book provides an in-depth understanding of free space optical (FSO) communication with a particular emphasis on optical beam propagation throu...
