This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and...
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs...
This book provides a comprehensive set of optimization and prediction techniques for an enterprise information system. Readers with a background in operations research, system engineering, statistics, or data analytics can use this book as a reference to derive insight from data and use this knowledge as guidance for production management. The authors identify the key challenges in enterprise information management and present results that have emerged from leading-edge research in this domain. Coverage includes topics ranging from task scheduling and resource allocation, to workflow...
This book provides a comprehensive set of optimization and prediction techniques for an enterprise information system. Readers with a background in...
The technical contributions presented in this book will not only shorten the product development cycle, but also accelerate the adoption and further development of modern flow-based microfluidic biochips, by facilitating the full exploitation of design complexities that are possible with current fabrication techniques.
The technical contributions presented in this book will not only shorten the product development cycle, but also accelerate the adoption and further d...
