This book serves as a handbook/primer for those converting from standard Sn-Pb solder microelectronic assemblies to Pb-free systems. It covers key aspects associated with this issue, including health, total environmental impact, legislation, market economics, and related materials, process, and reli

Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and...