Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI...
Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need ...
This book describes several methods and systems solving one of the highlighted problems within computer aided design, namely architectural and logic synthesis. The book emphasises the most recent technologies in high level synthesis, concentrating on applicative studies and practical constraints or criteria during synthesis. Logic and Architecture Synthesis concentrates on the practical problems involving automatic synthesis of designs. It is essential reading for researchers and CAD Managers working in this area.
This book describes several methods and systems solving one of the highlighted problems within computer aided design, namely architectural and logic s...
Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI...
Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need ...