Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits

ISBN-13: 9780792395447 / Angielski / Twarda / 1994 / 280 str.

Nishath K. Verghese; Timothy J. Schmerbeck; David J. Allstot

Opis

The goal of putting systems on a chip has been a difficult challenge that is only recently being met. Since the world is analogue, putting systems on a chip requires putting analogue interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analogue and digital circuitry are being designed. Whether a small amount of analogue circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analogue and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem.

Spis treści

List of Figures. List of Tables. Preface. 1. Introduction. 2. Sources of Noise and Methods of Coupling. 3. Semiconductor Device Simulation. 4. Simplified Substrate Modeling and Rapid Simulation. 5. Mesh Generation. 6. Substrate Modeling in Heavily-Doped Bulk Process. 7. Substrate Resistance Extraction for Large Circuits. 8. Modeling Chip/Package Power Distribution. 9. Controlling Substrate Coupling in Heavily-Doped Bulk Processes. 10. Controlling Substrate Coupling in Bulk P-Wafers. 11. Chip/Package Shielding and Good Circuit Design Practice. 12. A Design Example. Appendices. A: Mesh Moments. B: Convergence Behaviour of Iterative Methods. Index.