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This book explores the life and scientific legacy of Manfred Schroeder through personal reflections, scientific essays and Schroeder's own memoirs. Reflecting the wide range of Schroeder's activities, the first part of the book contains thirteen articles written by his colleagues and former students. Topics discussed include his early, pioneering contributions to the understanding of statistical room acoustics and to the measurement of reverberation time; his introduction of digital signal processing methods into acoustics; his use of ray tracing methods to study sound decay in rooms and...

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1^st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint...

This book comprises the select proceedings of the International Conference on Power Engineering Computing and Control (PECCON) 2019. This volume covers several important topics such as optimal data selection and error-free data acquiring via artificial intelligence and machine learning techniques, information and communication technologies for monitoring and control of smart grid components, and data security in smart grid network. In addition, it also focuses on economics of renewable electricity generation, policies for distributed generation, smart eco-structures and...

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1^st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint...