Advanced Wirebond Interconnection Technology

ISBN-13: 9781402077623 / Angielski / Mixed media product / 2004 / 669 str.

Shankara K. Prasad

Opis

Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.

Recenzje

From the reviews:

"....intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers.... This book has excellent overall tutorial and enough description of wire and bonding equipment.... If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." (IEEE CPMT, Newsletter)

"This book is intended for an assembly ... . is very good with 'visual' explanations for quick grasping of the issues. ... The book has a clear prose style and a very readable font and page layout. ... has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. ... A short but good reference section is at the end." (David W. Palmer, IEEE / CPUT Newsletter, Vol. 28 (2), 2005)

Spis treści

Materials for Wire Bonding.- Bonding Equipment.- Process Technology.- Quality.- Reliability.- New Technologies and New Applications for Wire Bonding.