Wyniki wyszukiwania:
wyszukanych pozycji: 29
 |
System on Package: Miniaturization of the Entire System
ISBN: 9780071459068 / Angielski / Twarda / 2007 / 785 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych (Dostawa w 2026 r.) System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing...
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to ...
|
cena:
737,54 |
 |
Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
ISBN: 9781259861550 / Angielski / Twarda / 2019 / 848 str. Termin realizacji zamówienia: ok. 30 dni roboczych (Dostawa w 2026 r.) A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The... A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous a... |
cena:
940,83 |
 |
Investigations on Antenna Array Pattern Synthesis
ISBN: 9786202564168 / Angielski / Miękka / 2020 / 220 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych (Dostawa w 2026 r.) |
cena:
343,97 |
 |
Microelectronics Packaging Handbook: Subsystem Packaging Part III
ISBN: 9780412084515 / Angielski / Twarda / 1997 / 628 str. Termin realizacji zamówienia: ok. 22 dni roboczych (Dostawa w 2026 r.) This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation...
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics des...
|
cena:
603,81 |
 |
Microelectronics Packaging Handbook: Technology Drivers Part I
ISBN: 9780412084317 / Angielski / Twarda / 1997 / 752 str. Termin realizacji zamówienia: ok. 22 dni roboczych (Dostawa w 2026 r.) Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical...
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a coun...
|
cena:
805,10 |
 |
Microelectronics Packaging Handbook: Technology Drivers Part I
ISBN: 9781461368298 / Angielski / Miękka / 2012 / 720 str. Termin realizacji zamówienia: ok. 22 dni roboczych (Dostawa w 2026 r.) Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical...
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a coun...
|
cena:
805,10 |
 |
Microstructural, Emission Studies of Zirconium Silicate Glass Matrix
ISBN: 9783659744020 / Angielski / Miękka / 2015 / 292 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych (Dostawa w 2026 r.) The book deals with the studies on "Microstructural, dielectric and spectroscopic properties of Li2O-Nb2O5-ZrO2-SiO2 glass system crystallized with CuO and V2O5 & Emission features of Nd3+ and Ho3+ ions in Li2O-Nb2O5/Ta2O5/La2O3-ZrO2-SiO2 glass systems". This work has been carried out in the Department of Physics, Acharya Nagarjuna University - Dr.M.R.A.R Campus, Nuzvid. The book contains the methods of preparation,characterization and studies on dielectric and spectroscopic properties including photo-induced second order susceptibility studies of Li2O-Nb2O5-ZrO2-SiO2 glass systems...
The book deals with the studies on "Microstructural, dielectric and spectroscopic properties of Li2O-Nb2O5-ZrO2-SiO2 glass system crystallized with Cu...
|
cena:
370,81 |
 |
Psychoanalytic Theory and Cultural Competence in Psychotherapy
ISBN: 9781433821547 / Angielski / Twarda / 2016 / 296 str. Termin realizacji zamówienia: ok. 30 dni roboczych (Dostawa w 2026 r.) While psychoanalytic scholars often address specific aspects of diversity such as gender, race, immigration, religion, sexual orientation, and social class, the literature lacks a set of core principles to inform and support culturally competent practice. This approachable volume responds to that pressing need.
While psychoanalytic scholars often address specific aspects of diversity such as gender, race, immigration, religion, sexual orientation, and social ...
|
cena:
301,18 |
 |
Reliability Analysis of Composite Power Systems using FACTS Controllers
ISBN: 9781329654082 / Angielski / Miękka / 2015 / 116 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych (Dostawa w 2026 r.) |
cena:
55,22 |
 |
Psychoanalytic Theory and Cultural Competence in Psychotherapy
ISBN: 9781433841880 / Angielski / Miękka / 2022 / 296 str. Termin realizacji zamówienia: ok. 30 dni roboczych (Dostawa w 2026 r.) |
cena:
301,18 |
 |
Trauma and Racial Minority Immigrants: Turmoil, Uncertainty, and Resistance
ISBN: 9781433833694 / Angielski / Miękka / 2021 / 341 str. Termin realizacji zamówienia: ok. 30 dni roboczych (Dostawa w 2026 r.) |
cena:
262,32 |
 |
Electronic Packaging for High Reliability, Low Cost Electronics
ISBN: 9780792352181 / Angielski / Twarda / 2000 / 296 str. Termin realizacji zamówienia: ok. 22 dni roboczych (Dostawa w 2026 r.) Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in...
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are ...
|
cena:
603,81 |
 |
Probability and Random Processes for Electrical and Computer Engineers
ISBN: 9781439826980 / Angielski / Twarda / 2011 / 431 str. Termin realizacji zamówienia: ok. 22 dni roboczych (Dostawa w 2026 r.) With updates and enhancements to the incredibly successful first edition, Probability and Random Processes for Electrical and Computer Engineers, Second Edition retains the best aspects of the original but offers an even more potent introduction to probability and random variables and processes. Written in a clear, concise style that illustrates the subject s relevance to a wide range of areas in engineering and physical and computer sciences, this text is organized into two parts. The first focuses on the probability model, random variables and transformations, and inequalities and limit... With updates and enhancements to the incredibly successful first edition, Probability and Random Processes for Electrical and Computer Engineers, S... |
cena:
398,30 |
 |
Microelectronics Packaging Handbook: Semiconductor Packaging
ISBN: 9780412084416 / Angielski / Twarda / 1997 / 1030 str. Termin realizacji zamówienia: ok. 22 dni roboczych (Dostawa w 2026 r.) Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical...
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a coun...
|
cena:
1408,95 |
 |
Politics of Preference: India, United States, and South Africa
ISBN: 9781466503892 / Angielski / Twarda / 2014 / 225 str. Termin realizacji zamówienia: ok. 22 dni roboczych (Dostawa w 2026 r.) Minorities, based on whatever criteria--linguistic, religious, ethnic, tribal, racial, or otherwise--share a distinctive contextual and social experience. Their representation in public service is important, especially when there have been public policies which have historically discriminated against them. Politics of Preference: India, United States, and South Africa discusses the importance of offsetting past discrimination in an attempt at bringing all citizens in as active participants of their representative bureaucracies. The author, a distinguished public administration... Minorities, based on whatever criteria--linguistic, religious, ethnic, tribal, racial, or otherwise--share a distinctive contextual and social expe... |
cena:
349,71 |
 |
Comparative Bureaucratic Systems
ISBN: 9780739106273 / Angielski / Twarda / 2003 / 484 str. Termin realizacji zamówienia: ok. 30 dni roboczych (Dostawa w 2026 r.) In today's politically and economically complex and interdependent world, scholars, professional administrators, and laypersons alike increasingly recognize the importance of bureaucracies. In this timely volume, contributors with demonstrated expertise in a range of geographical areas advance our understanding of public administration worldwide through extensive research and incisive analysis. Covering the public sector both in more- and less-developed nations, this book sheds new light on the means by which the 'fourth branch of government' can be made both effective and well-suited to the...
In today's politically and economically complex and interdependent world, scholars, professional administrators, and laypersons alike increasingly rec...
|
cena:
607,23 |
 |
Comparative Bureaucratic Systems
ISBN: 9780739109670 / Angielski / Miękka / 2005 / 484 str. Termin realizacji zamówienia: ok. 30 dni roboczych (Dostawa w 2026 r.) The contributors to Comparative Bureaucratic Systems advance our understanding of public administration via broad-ranging research and incisive analysis. Covering the public sector in both more and less developed nations, this book sheds new light on the means by which the Ofourth branch of governmentO can be made both effective and suited to the local culture. This collection is a valuable resource for scholars of political science as well as for practictioners of public administration in the United States and abroad.
The contributors to Comparative Bureaucratic Systems advance our understanding of public administration via broad-ranging research and incisive analys...
|
cena:
272,03 |
 |
Embers of Us
ISBN: 9789370922006 / Angielski Termin realizacji zamówienia: ok. 16-18 dni roboczych (Dostawa w 2026 r.) |
cena:
42,57 |
 |
A STUDY OF MECHANICAL BEHAVIOUR OF STANDARD GRADE TERNARY BLEND GLASS
ISBN: 9786204184500 / Angielski / Miękka / 348 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych (Dostawa w 2026 r.) Conventional concrete used in building and civil engineering applications requires compaction to achieve strength, durability and homogeneity. The typical method of compaction by vibration, generates delay and additional cost in projects and moreover is a serious health hazard on and round construction sites. Though compaction techniques have advanced over the years, the process is still complicated in areas of the structure with congested reinforcement and complex forms. An efficient solution for achieving durable concrete structures independent of the quality of construction work is to...
Conventional concrete used in building and civil engineering applications requires compaction to achieve strength, durability and homogeneity. The typ...
|
cena:
393,17 |
 |
Electronic Packaging for High Reliability, Low Cost Electronics
ISBN: 9789048150854 / Angielski / Miękka / 2010 / 296 str. Termin realizacji zamówienia: ok. 22 dni roboczych (Dostawa w 2026 r.) Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as...
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices ar...
|
cena:
603,81 |
Czytaj nas na:
KrainaKsiazek.PL - Księgarnia Internetowa
