Study of SnAgCu Alloy Reliability » książka
Study of SnAgCu Alloy Reliability
ISBN-13: 9783639133271 / Angielski / Miękka / 2009 / 188 str.
This work aims to understand the reliability of SnAgCu solder interconnects used in PBGA packages using microstructure evolution, laser moire interferometry and finite-element modeling. A particle coarsening based microstructure evolution of the solder joint material during thermal excursions was studied for extended periods of time lasting for several months. The microstructure evolution and particle coarsening was quantified, and acceleration factors were determined between benign field-use conditions and ATC conditions for PBGA packages with different form factors and for two different lead-free solder alloys. A new technique using laser moire interferometry was developed to assess the deformation behavior of SnAgCu based solder joints during thermal excursions. This technique can used to estimate the fatigue life of solder joints quickly in a matter of few days instead of months. FEA in conjunction with experimental data from the ATC for different lead-free PBGA packages was used to develop a fatigue life model that can be used to predict solder joint fatigue life for any PBGA package."
This work aims to understand the reliability ofSnAgCu solder interconnects used in PBGA packagesusing microstructure evolution, laser moiréinterferometry and finite-element modeling. Aparticle coarsening based microstructure evolution ofthe solder joint material during thermal excursionswas studied for extended periods of time lasting forseveral months. The microstructure evolution andparticle coarsening was quantified, and accelerationfactors were determined between benign field-useconditions and ATC conditions for PBGA packages withdifferent form factors and for two differentlead-free solder alloys. A new technique using lasermoiré interferometry was developed to assess thedeformation behavior of SnAgCu based solder jointsduring thermal excursions. This technique can used toestimate the fatigue life of solder joints quickly ina matter offew days instead of months. FEA in conjunction withexperimental data from the ATC for differentlead-free PBGA packages was used to develop a fatiguelife model that can be used to predict solder jointfatigue life for any PBGA package.
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