wyszukanych pozycji: 40
3D Videofon dlq Pogruzheniq w Inercial'nuü Kommunikaciü
ISBN: 9786203323764 / Rosyjski / Miękka / 132 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych. |
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cena:
265,77 zł |
Comparative Analysis of Pulse Width Modulation Schemes
ISBN: 9783659271212 / Angielski / Miękka / 2012 / 104 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych. Space vector pulse width modulation (SVPWM) is an optimum pulse width modulation technique for an inverter used in a variable frequency drive applications. It is computationally rigorous and hence limits the inverter switching frequency. This book discusses a time equivalent SVPWM and neural Network based SVPWM technique for a five-phase voltage source inverter in under modulation region. A neural network has the advantage of very fast implementation of an SVPWM algorithm that can increase the inverter switching frequency. The scheme has been simulated and comparative study is given with the...
Space vector pulse width modulation (SVPWM) is an optimum pulse width modulation technique for an inverter used in a variable frequency drive applicat...
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cena:
220,72 zł |
Profitable Pages: Mastering Book Revenue Recognition Strategies
ISBN: 9798399577845 / Angielski Termin realizacji zamówienia: ok. 13-18 dni roboczych. |
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cena:
68,30 zł |
Breaking the Stress Cycle: : Unleashing Your True Potential in the Corporate Jungle
ISBN: 9798852015105 / Angielski Termin realizacji zamówienia: ok. 13-18 dni roboczych. |
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cena:
68,30 zł |
Visiophone 3D pour la communication immersive
ISBN: 9786203323634 / Francuski / Miękka / 120 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych. Le concept de visiophone 3D est proposé pour réaliser une communication vidéo plus proche de la conversation naturelle en face à face. Des évaluations de l'interface visuelle humaine sont effectuées pour confirmer le choix de l'affichage pour la présentation des informations visuelles et la configuration appropriée du terminal pour le matériel de base du système. Les résultats montrent que l'affichage 3D est préféré à l'affichage 2D conventionnel en tant qu'actionneur de représentation d'informations visuelles en raison de la proximité de la conversation naturelle en face à...
Le concept de visiophone 3D est proposé pour réaliser une communication vidéo plus proche de la conversation naturelle en face à face. Des évalua...
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cena:
265,77 zł |
3D-Bildtelefon für immersive Kommunikation
ISBN: 9786203323610 / Niemiecki / Miękka / 124 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych. Das Konzept des 3D-Videotelefons wird vorgeschlagen, um eine Videokommunikation zu realisieren, die näher an einem natürlichen Gespräch von Angesicht zu Angesicht ist. Es werden Evaluierungen der menschlichen visuellen Schnittstelle durchgeführt, um die Wahl des Displays für die visuelle Informationsdarstellung und die geeignete Endgerätekonfiguration für die Kernhardware des Systems zu bestätigen. Die Ergebnisse zeigen, dass ein 3D-Display gegenüber dem herkömmlichen 2D-Display als Aktor für die visuelle Informationsdarstellung aufgrund der Nähe zu einem natürlichen Gespräch...
Das Konzept des 3D-Videotelefons wird vorgeschlagen, um eine Videokommunikation zu realisieren, die näher an einem natürlichen Gespräch von Angesic...
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cena:
265,77 zł |
3D-beeldtelefoon voor meeslepende communicatie
ISBN: 9786203323733 / Holenderski / Miękka / 120 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych. |
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cena:
265,77 zł |
Videofone 3D para Comunicação Imersiva
ISBN: 9786203323757 / Portugalski / Miękka / 120 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych. |
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cena:
265,77 zł |
Videotelefono 3D per la comunicazione immersiva
ISBN: 9786203323689 / Włoski / Miękka / 116 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych. |
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cena:
265,77 zł |
Wideofon 3D do komunikacji immersyjnej
ISBN: 9786203323740 / Polski / Miękka / 120 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych. |
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cena:
265,77 zł |
Intelligent Manufacturing & Mechatronics: Proceedings of Symposium, 29 January 2018, Pekan, Pahang, Malaysia
ISBN: 9789811342394 / Angielski / Miękka / 2018 / 723 str. Termin realizacji zamówienia: ok. 20 dni roboczych. |
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cena:
1072,03 zł |
Android Application for Online Traffic Complaint in UniSZA using GPS : E-Traffic
ISBN: 9783639661934 / Angielski / Miękka / 2016 / 76 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych. |
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cena:
206,76 zł |
Technological Advancement in Instrumentation & Human Engineering: Selected Papers from Icmer 2021
ISBN: 9789811915765 / Angielski / Twarda / 2022 Termin realizacji zamówienia: ok. 20 dni roboczych. This book (Technological Advancement in Instrumentation & Human Engineering) gathers selected papers submitted to the 6th International Conference on Mechanical Engineering Research in fields related to human engineering, ergonomics, vibration, instrumentation, Internet of Things and signal processing. This proceeding consists of papers in aforementioned related fields presented by researchers and scientists from universities, research institutes and industry showcasing their latest findings and discussions with an emphasis on innovations and developments in embracing the new norm,... This book (Technological Advancement in Instrumentation & Human Engineering) gathers selected papers submitted to the 6th International Conference ... |
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cena:
880,59 zł |
Intelligent Manufacturing & Mechatronics: Proceedings of Symposium, 29 January 2018, Pekan, Pahang, Malaysia
ISBN: 9789811087875 / Angielski / Twarda / 2018 / 723 str. Termin realizacji zamówienia: ok. 20 dni roboczych. This book presents the proceedings of SympoSIMM 2018, the 1st edition of the Symposium on Intelligent Manufacturing and Mechatronics.
This book presents the proceedings of SympoSIMM 2018, the 1st edition of the Symposium on Intelligent Manufacturing and Mechatronics.
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cena:
1072,03 zł |
Jade's Food for Thought: Delicious Discoveries through Diversity
ISBN: 9798390760680 / Angielski Termin realizacji zamówienia: ok. 13-18 dni roboczych. |
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cena:
58,97 zł |
Recent Progress in Lead-Free Solder Technology: Materials Development, Processing and Performances
ISBN: 9783030934439 / Angielski / Miękka / 2023 / 328 str. Termin realizacji zamówienia: ok. 20 dni roboczych. This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters...
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It...
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cena:
650,86 zł |
Recent Progress in Lead-Free Solder Technology: Materials Development, Processing and Performances
ISBN: 9783030934408 / Angielski / Twarda / 2022 / 342 str. Termin realizacji zamówienia: ok. 20 dni roboczych. |
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cena:
650,86 zł |
Advances in Robotics, Automation and Data Analytics: Selected Papers from Icites 2020
ISBN: 9783030709167 / Angielski / Miękka / 2021 / 415 str. Termin realizacji zamówienia: ok. 20 dni roboczych. |
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cena:
765,72 zł |
Leadership Thinking 101: The Art of Strategic Minds
ISBN: 9798853150324 / Angielski Termin realizacji zamówienia: ok. 13-18 dni roboczych. |
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cena:
68,30 zł |
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium: Epits 2022, 14-15 September, Langkawi, Malaysia
ISBN: 9789811992667 / Angielski Termin realizacji zamówienia: ok. 20 dni roboczych. This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14thand 15thof Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced...
This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in L...
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cena:
650,86 zł |