Integrated Multiferroic Heterostructures and Applications

ISBN-13: 9783527341771 / Angielski / Twarda / 2019 / 264 str.

Ming Liu; Ziyao Zhou

Opis

Written by well–known experts in the field, this first systematic overview of multiferroic heterostructures summarizes the latest developments, first presenting the fundamental mechanisms, including multiferroic materials synthesis, structures and mechanisms, before going on to look at device applications.

Spis treści

1. Introduction to multiferroics and its application

2. Multiferroics Materials
1) Single phase multiferroic
2) Multiferroic composites/
Heterostructures
a) Oxides multiferroic Heterostructures
b) Metallic/ferroelectric multiferroics heterostructures
3) Synthesis of multiferroic material
a) Bulk multiferroic material
b) Thin film multiferroic material
c) Nanostructure multiferroic material

3. Mechanisms of multiferroic material
1) Strain/stress induced ME coupling
2) EM–spin wave coupling
3) Interfacial charge induced ME coupling
4) BFO system
5) Spiral spin order control RMnO3
6) Other novel interfacial ME coupling effects

4. Multiferroic simulations
1). First–principle calculation
2). Phase simulation
3). Theoretical modes of ME coupling in multiferroic heterostructures

5. Multiferroic RF/microwave devices
1) Voltage control of FMR
2) RF/microwave devices in general
3) State of the art tunable RF/microwave devices
a) Antenna
b) Inductor
c) Bandpass/stop filters
d) Phase shifter
4) Multiferroic RF/microwave devices in future

6. Towards to Multiferroic Memories
1) Voltage control of magnetism
a) Magnetoresistance
b) Voltage control of exchange bias
c) Voltage control of domain dynamics
d) Towards non–volatile control
2) Magnetic memories in general
3) State of the art multiferroic memories
4) Multiferroic memories in future

7. Multiferroic Sensors
1) Inverse ME coupling
2) Magnetic sensors in general
3) State of the art multiferroic sensors
4) Multiferroic memories in future

8. Integration of multiferroics on chip
1) Integration of multiferroic RF/microwave devices
2) Integration of multiferroic memories
3) Integration of multiferroic sensors

9. Multiferroics in future
1) Novel multiferroic composites
2) Novel multiferroic devices and applications

O autorze

Dr. Ming Liu is Professor at the School of Electrical and Information Engineering, and Director of the laboratory for Integrated Multiferroic Materials and Devices at Xi′an Jiaotong University, China. He obtained his PhD from Northeastern University, USA. Before he joined Xi′an Jiaotong University, he was a research scientist at United Air Force Research Laboratory and Argonne Scholar at Argonne National Laboratory, USA. His research is focused on integrated multiferroics. He has contributed more than 90 scientific publications and one of the first–authored paper was selected as "the 10 most outstanding full papers in the past ten years (2001∼2010) in Advanced Functional Materials. He is an editorial review board member of Scientific Reports and IEEE Mag. Lett.

Dr. Ziyao Zhou is an Argonne Scholar at Energy Systems Division, Argonne National Laboratory, USA. He received his PhD from Electrical and Computer Engineering department at Northeastern University, USA. His research has been on integrated nanostructures and multiferroics for energy–efficient electronics and spintronics. He has contributed to a number of publications and related patents and patent disclosures.