Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability

ISBN-13: 9780081020944 / Angielski / Miękka / 2018 / 240 str.

Katsuaki Suganuma

Spis treści

Part 1 Fundamentals and Materials 1. Introduction 2. Interconnect Technologies 3. Substrates

Part 2 Components 4. Magnetic materials

Part 3 Performance Measurement and Reliability Evaluation 5. Cooling System: Al and Cu Cooling Systems 6. Thermal Transient Testing 7. Reliability Evaluation 8. CAE Simulation

Part 4 Future Prospects 9. Future Solutions

O autorze

Dr. Katsuaki Suganama graduated from Tohoku University Faculty of Engineering in 1977, and since then has had a highly influential role within the fields of Physical properties of metals/Metal-base materials, Inorganic industrial materials, Metal making/Resorce production engineering, Material processing/Microstructural control engineering, Structural/Functional materials, Composite materials/Surface and interface engineering, Inorganic materials/Physical properties, Electronic materials/Electric materials.

He has published several academic papers and books during his career, and has won many prestigious awards such as Best Paper of Symposium/Best Paper of Session in the 33rd International Symposium on Microelectronics and the Richard M. Fularth Pacific Award. He has worked as Professor at Osaka University Institute of Scientific and Industrial Research since 1996.