• Wyszukiwanie zaawansowane
  • Kategorie
  • Kategorie BISAC
  • Książki na zamówienie
  • Promocje
  • Granty
  • Książka na prezent
  • Opinie
  • Pomoc
  • Załóż konto
  • Zaloguj się

Transactions on Engineering Technologies: World Congress on Engineering 2019 » książka

zaloguj się | załóż konto
Logo Krainaksiazek.pl

koszyk

konto

szukaj
topmenu
Księgarnia internetowa
Szukaj
Książki na zamówienie
Promocje
Granty
Książka na prezent
Moje konto
Pomoc
 
 
Wyszukiwanie zaawansowane
Pusty koszyk
Bezpłatna dostawa dla zamówień powyżej 20 złBezpłatna dostawa dla zamówień powyżej 20 zł

Kategorie główne

• Nauka
 [2949965]
• Literatura piękna
 [1857847]

  więcej...
• Turystyka
 [70818]
• Informatyka
 [151303]
• Komiksy
 [35733]
• Encyklopedie
 [23180]
• Dziecięca
 [617748]
• Hobby
 [139972]
• AudioBooki
 [1650]
• Literatura faktu
 [228361]
• Muzyka CD
 [398]
• Słowniki
 [2862]
• Inne
 [444732]
• Kalendarze
 [1620]
• Podręczniki
 [167233]
• Poradniki
 [482388]
• Religia
 [509867]
• Czasopisma
 [533]
• Sport
 [61361]
• Sztuka
 [243125]
• CD, DVD, Video
 [3451]
• Technologie
 [219309]
• Zdrowie
 [101347]
• Książkowe Klimaty
 [123]
• Zabawki
 [2362]
• Puzzle, gry
 [3791]
• Literatura w języku ukraińskim
 [253]
• Art. papiernicze i szkolne
 [7933]
Kategorie szczegółowe BISAC

Transactions on Engineering Technologies: World Congress on Engineering 2019

ISBN-13: 9789811582752 / Angielski / Miękka / 2021 / 260 str.

Ao, Sio-Iong
Transactions on Engineering Technologies: World Congress on Engineering 2019 Ao, Sio-Iong 9789811582752 Springer Singapore - książkaWidoczna okładka, to zdjęcie poglądowe, a rzeczywista szata graficzna może różnić się od prezentowanej.

Transactions on Engineering Technologies: World Congress on Engineering 2019

ISBN-13: 9789811582752 / Angielski / Miękka / 2021 / 260 str.

Ao, Sio-Iong
cena 605,23 zł
(netto: 576,41 VAT:  5%)

Najniższa cena z 30 dni: 578,30 zł
Termin realizacji zamówienia:
ok. 22 dni roboczych
Bez gwarancji dostawy przed świętami

Darmowa dostawa!
inne wydania

This book contains a selection of research articles written by prominent researchers participating in The 27th World Congress on Engineering (WCE 2019) which was held in London, UK, July 3–5, 2019. Topics covered include engineering mathematics, electrical engineering, communications systems, computer science, chemical engineering, systems engineering, manufacturing engineering, and industrial applications. With contributions carefully chosen to represent the most cutting-edge research presented during the conference, the book contains some of the state of the art in engineering technologies and the physical sciences and their applications and serves as a useful reference for researchers and graduate students working in these fields.

Kategorie:
Technologie
Kategorie BISAC:
Technology & Engineering > Industrial Engineering
Computers > Software Development & Engineering - Computer Graphics
Computers > Artificial Intelligence - General
Wydawca:
Springer Singapore
Język:
Angielski
ISBN-13:
9789811582752
Rok wydania:
2021
Ilość stron:
260
Waga:
0.36 kg
Wymiary:
23.39 x 15.6 x 1.4
Oprawa:
Miękka
Wolumenów:
01
Dodatkowe informacje:
Wydanie ilustrowane

Selected topics in mechanical engineering

Selected topics in bioengineering

Selected topics in internet engineering

Selected topics in image engineering

Selected topics in wireless networks

Selected topics in knowledge engineering

Selected topics in manufacturing engineering

Selected topics in industrial applications

Dr. Sio-Iong Ao finished his doctoral research at The University of Hong Kong and postdoctoral researches at the University of Oxford and Harvard University and is a former Visiting Professor of Cranfield University, UK, and University of Wyoming, USA.

Len Gelman, PhD, Dr. of Sciences (Habilitation) joined HuddersfieldUniversity as Professor, Chair in Signal Processing/ Condition Monitoring and Director of Centre for Efficiency and Performance Engineering, in 2017 from Cranfield University, where he worked as Professor and Chair in Vibro-Acoustical Monitoring since 2002.

Len developed novel condition monitoring technologies for aircraft engines, gearboxes, bearings, turbines and centrifugal compressors. Len published more than 250 publications, 17 patents and is co-editor of 11 Springer books. He is Fellow of:BINDT, International Association of Engineers and Institution of Diagnostic Engineers, Executive Director, International Society for Condition Monitoring, Honorary Technical Editor, International Journal of Condition Monitoring, Editor-in-Chief, International Journal of Engineering Sciences (SCMR),Chair, annual International Condition Monitoring Conferences, Honorary Co-Chair, annual World Congresses of Engineering, Co-Chair, International Conference COMADEM 2019 and  Chair, International Scientific Committee of Third World Congress, Condition Monitoring.

He was General Chair,First World Congress, Condition Monitoring, Chair, Second World Congress, Engineering Asset Management and Chair, International Committee of Second World Congress, Condition Monitoring.Len is Chair of International CM Groups of ICNDT and EFNDT and Member of ISO Technical Committee, Condition Monitoring. Len made 42 plenary keynotes at major international conferences. He was Visiting Professor at ten Universities abroad.

Professor Haeng-Kon Kim is a Vice President of Research and Information, a Dean of engineering college and a Professor in the Department of Computer Engineering Catholic University of Daegu, in Korea. He has been a research staff member in Bell Lab. and NASA Center in USA. Professor Kim is Chief Editor of KIPS SE-Sig journal and Korea Multimedia Society, an editorial board of KISS (Korea Information Science Society) and a steering committee of KIPS (Korea Information Processing Society).

This book contains a selection of research articles written by prominent researchers participating in The 27th World Congress on Engineering (WCE 2019) which was held in London, UK, July 3–5, 2019. 

Topics covered include engineering mathematics, electrical engineering, communications systems, computer science, chemical engineering, systems engineering, manufacturing engineering, and industrial applications. With contributions carefully chosen to represent the most cutting-edge research presented during the conference, the book contains some of the state of the art in engineering technologies and the physical sciences and their applications and serves as a useful reference for researchers and graduate students working in these fields.



Udostępnij

Facebook - konto krainaksiazek.pl



Opinie o Krainaksiazek.pl na Opineo.pl

Partner Mybenefit

Krainaksiazek.pl w programie rzetelna firma Krainaksiaze.pl - płatności przez paypal

Czytaj nas na:

Facebook - krainaksiazek.pl
  • książki na zamówienie
  • granty
  • książka na prezent
  • kontakt
  • pomoc
  • opinie
  • regulamin
  • polityka prywatności

Zobacz:

  • Księgarnia czeska

  • Wydawnictwo Książkowe Klimaty

1997-2025 DolnySlask.com Agencja Internetowa

© 1997-2022 krainaksiazek.pl
     
KONTAKT | REGULAMIN | POLITYKA PRYWATNOŚCI | USTAWIENIA PRYWATNOŚCI
Zobacz: Księgarnia Czeska | Wydawnictwo Książkowe Klimaty | Mapa strony | Lista autorów
KrainaKsiazek.PL - Księgarnia Internetowa
Polityka prywatnosci - link
Krainaksiazek.pl - płatnośc Przelewy24
Przechowalnia Przechowalnia