Tin and Solder Plating in the Semiconductor Industry

ISBN-13: 9780412482403 / Angielski / Twarda / 1992 / 326 str.

A. C. Tan

Opis

The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.

Spis treści

Preface. Acknowledgements. Glossary of terms. Introduction. Basic electroplating. Surface preparation for plating. Plating operation. Plating process control. Plating quality assurance. Corrosion. Properties of tin, lead and tin-lead alloy. Tin plating. Tin-lead alloy plating. Plating quality problems. Chemical analysis. Choice of metal finishing. Waste treatment. Improvements and future trends. Index.