Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

ISBN-13: 9781032160818 / Angielski / Twarda / 2021 / 290 str.

Juan Cepeda-Rizo; Jeremiah Gayle; Joshua Ravich

Opis

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

Spis treści

Introduction. New Space. Thermal/Structural Challenges in Miniaturizing. Fundamental of Heat Transfer by Conduction and Convection. Fundamentals of Heat Transfer by Radiation. The Multi-Layer Insulation (MLI) Blanket. Heat Pipes. Convective Cooling of Semiconductors using a Nanofluid. Power Systems: The Tesla Turbine. Electronics Design for Extreme Temperature and Pressure. Characterization and Modeling of PWB Warpage and its Effect on LGA Separable Interconnects. Resistor Networks. Thermal Analysis Case Studies. Random Vibration Structural Analysis and Mile’s Equation. Vibrational Analysis Case Studies. Creep Prediction of a Printed Wiring Board for Separable Land Grid Array Connector. Operational Case Studies – Mars Surface Operations. Operational Case Studies – Dawn Asteroid Mission. Standards.