Thermal Conductivity 25/Thermal Expansion 13

ISBN-13: 9781566768061 / Angielski / Twarda / 2000 / 391 str.

Opis

Proceedings of the joint conferences of the Twenty-Fifth International ThermalConductivity Conference and the Proceedings of the Thirteenth International Thermal Expansion Symposium, on June 13-16, 1999 in Ann Arbor, Michigan USA.

Spis treści

Thermal Conductivity Techniques, Thermal Expansion, Low temperature Thermal Conductivity, Thermal Insulation, Thermal Conductivity- Films, Theory and Standards, Special Plenary Session, Thermal Conductivity-Fluids.

O autorze

Ctirad Uher and Donald Morelli- editors.