Systems-Level Packaging for Millimeter-Wave Transceivers

ISBN-13: 9783030146894 / Angielski / Twarda / 2019 / 277 str.

Mladen Bozanic; Saurabh Sinha

Spis treści

Introduction and Research Impact.- Millimeter-Wave Research Challenges.-Behavior of Active and Passive Devices at Millimeter-Wave Frequencies.- Integrated Substrates: Millimeter-Wave Transistor Technologies.- Discrete Substrates: Package Foundation.- Traditional Approach: System-on-Chip.- Multi-Chip Modules and Multi-Chip Packaging.- State-of-the-Art Approach: System-on-Package.- Evaluation of Research Questions, Remaining Research Gaps and Future Directions.

O autorze

Mladen Božanić (Ph.D, University of Pretoria), is a Senior IC Design Engineer responsible for mixed-mode design and design-for-test at Azoteq, South Africa and part-time researcher at the Department of Electrical and Electronic Engineering Science, University of Johannesburg. He is a Specialist Editor of South African Institute of Electrical Engineers (SAIEE) Africa Research Journal for the field of microelectronics and has authored or co-authored over 25 peer-reviewed contributions.

Prof Saurabh Sinha obtained his B.Eng, M.Eng, and Ph.D. degrees in Electronic Engineering from the University of Pretoria. As an established researcher, rated by the National Research Foundation (NRF), he has authored or co-authored over 110 publications in peer-reviewed journals and at international conferences. Prof Sinha is the Deputy Vice-Chancellor: Research and Internationalisation, University of Johannesburg. Prof Sinha served the 2014-2015 IEEE Board of Director and as IEEE Vice-President: Educational Activities.

Blurb

This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.