ISBN-13: 9783319343013 / Angielski / Miękka / 2016 / 174 str.
ISBN-13: 9783319343013 / Angielski / Miękka / 2016 / 174 str.
This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.