ISBN-13: 9783642839245 / Angielski / Miękka / 2011 / 188 str.
Bondgraphs are a powerful tool in the simulation of mechanical, hydraulic, electric and thermal systems. They are used to represent engineering systems in written form by means of letter elements and their interconnections, called bonds, instead of in the form of numerous equations. They may be used to increase the efficiency of new product design. This book introduces the reader to bondgraphs and their use on PCs. A broad variety of applications of this method in the simulation of the above systems is presented. Twenty fully worked examples complement the presentation.