Semiconductor Packaging: Materials Interaction and Reliability

ISBN-13: 9781439862056 / Angielski / Twarda / 2011 / 216 str.

Andrea Chen; Randy Lo

Opis

Focusing on materials technology for integrated circuit (IC) packaging, this comprehensive overview of semiconductor packaging materials also provides a working introduction to related subjects such as package form factors, interconnection technology, QA&R, and board assembly. It covers MEMS, solar, and LEDs, and considers the interaction of package materials on device performance and assembly technology. Accessible to newcomers as well as professionals, this book discusses the reliability tests and analytical tools necessary and touches on future trends in semiconductor packaging technology.

Spis treści

SEMICONDUCTOR PACKAGES: History and Background. Package Form Factors and Families. Surface-Mount Technology. Other Packaging Needs. PACKAGE RELIABILITY: Reliability Testing. MATERIALS USED IN SEMICONDUCTOR PACKAGING: Polymers. Metals. Ceramics and Glasses. THE FUTURE: Trends and Challenges. Light-Emitting Diodes. Appendices. Index.