Rheology and processing of pastes for electronic packaging materials : Novel rheological characterisation techniques for lead-free solder pastes and electrical conductive adhesives

ISBN-13: 9783639157468 / Angielski / Miękka / 2009 / 120 str.

Rajkumar Durairaj

Opis

The stencil printing of pastes (solder paste andelectrical conductive adhesives) is a very importantstage in the assembly of electronic packages. Thereis wide agreement in industry that the paste printingprocess accounts for the majority of assemblydefects, which originate from poor understanding ofthe correlation between the paste rheology and theprinting process. The development of new pastesformulations is a complex process. As a result moreextensive rheological characterisation techniques arerequired to understand the flow behaviour of thepastes under different shear conditions. This bookfocuses on the rheological characterisation of pastesand their correlation to the stencil printingprocess. A general guideline has been developed fromthe extensive set of results from this research, inparticular, on the aspect of correlating key pasteperformance indicators to the rheological testmethods. The book is aimed at paste and electronicmanufacturers with an interest of incorporatingrheology as a research and quality assurance tool intheir formulation and production processes.

O autorze

Dr.Rajkumar Durairaj is Assistant Professor of Mechanical
Engineering at the Universiti Tunku Abdul Rahman
(UTAR),Malaysia. His research interest is in rheological studies
of nano-electronic materials. He is a Member
of the Institution of Mechanical Engineers(UK) and a registered
Chartered Engineer with the Engineering Council(UK).