Rapid Analysis of Nonferrous Metals and Alloys » książka
Rapid Analysis of Nonferrous Metals and Alloys
ISBN-13: 9780820601007 / Angielski / Twarda / 1958 / 116 str.
CONTENTS - 1. SPECIAL REAGENTS - 2. INGOT COPPER - Copper; Lead and Iron; Bismuth; Antimony and Arsenic; Sulfur - 3. BRASSES AND BRONZES - Sequence Procedure for Copper, Lead, Tin, Nickel, and Iron in Brasses and Bronzes with Less than 0.3% Iron and No Manganese; Zinc; Phosphorus; Antimony; Sulfur; Sequence Procedure for Copper, Lead, Tin, Manganese, Nickel, Iron, and Aluminum in Manganese Bronzes; Zinc; Sequence Procedure for Copper, Lead, Tin, Manganese, Iron, and Aluminum in Copper-Nickel Alloys; Nickel; Zinc; Sequence Procedure for Copper, Lead, Iron, Nickel, and Manganese in Silicon Bronzes; Silicon and Tin; Aluminum; Phosphorus; Zinc; Sequence Procedure for Copper, Lead, Tin, Manganese, Nickel, and Iron in Copper-Beryllium Alloys; Cobalt; Silicon and Beryllium; Sequence Procedure for Copper, Lead, Iron, Nickel, Manganese, and Zinc in Copper-Arsenic Alloys; Aluminum; Silicon and Tin; Phosphorus; Arsenic - 4. MONEL METAL AND NICKEL METAL - Sequence Procedure for Silicon, Copper, Manganese, Iron, Aluminum, and Cobalt; Sulfur; Chromium; Titanium - 5. ALUMINUM ALLOYS - Sequence Procedure for Copper, Lead, Manganese, Iron, and Nickel; Copper in Separate Sample; Iron in Separate Sample; Zinc; Silicon; Magnesium; Titanium; Chromium; Tin; Copper, Lead, and Bismuth - 6. MAGNESIUM ALLOYS - Aluminum by the Succinate Method; Aluminum Colorimetrically; Zinc (over 1.5%) Electrolytically; Zinc (Less than 1.5%) by H28-ZnO Method; Sequence Procedure for Copper, Iron, and Nickel; Silicon; Manganese; Tin - 7. ZINC METAL (SPELTER) - Sequence Procedure for Tin, Copper, Lead, Iron, and Aluminum; Cadmium - 8. ZINC-BASE DIE-CASTING ALLOYS - Sequence Procedure for Tin, Copper, Lead, and Iron; Cadmium; Aluminum Colorimetrically; Aluminum and Magnesium by Mercury-Cathode Method - 9. CADMIUM METAL - Cadmium; Sequence Procedure for Tin, Lead, Iron, and Aluminum; Sequence Procedure for Silver, Copper, and Bismuth; Arsenic and Antimony; Zinc - 10. TIN METAL - Sequence Procedure for Bismuth, Copper, Lead, Iron and Zinc; Antimony; Arsenic - 11. LEAD METAL - Sequence Procedure for Tin, Silver, Iron, Bismuth and Copper; Antimony and Arsenic; Zinc - 12. LEAD-BASE BEARING METAL - Lead; Tin; Antimony; Arsenic; Copper; Bismuth; Iron - 13. TIN-BASE BEARING METAL - Tin; Antimony; Arsenic; Lead; Copper; Bismuth; Iron - 14. LEAD-TIN SOLDERS - Determination of Flux (Rosin Core); Determination of Flux (Zinc Chloride Core); Lead; Tin; Antimony; Arsenic; Copper; Bismuth; Iron - 15. SILVER SOLDERS - Sequence Procedure for Silver, Copper, Cadmium and Zinc; Sequence Procedure for Tin, Lead, Iron, and Nickel - 16. FUSIBLE BISMUTH ALLOYS - Sequence Procedure for Bismuth, Lead, and Cadmium - Index -
CONTENTS - 1. SPECIAL REAGENTS - 2. INGOT COPPER - Copper; Lead and Iron; Bismuth; Antimonyand Arsenic; Sulfur - 3. BRASSES AND BRONZES - Sequence Procedure for Copper, Lead, Tin,Nickel, and Iron in Brasses and Bronzes withLess than 0.3% Iron and No Manganese;Zinc; Phosphorus; Antimony; Sulfur; SequenceProcedure for Copper, Lead, Tin,Manganese, Nickel, Iron, and Aluminum inManganese Bronzes; Zinc; Sequence Procedurefor Copper, Lead, Tin, Manganese,Iron, and Aluminum in Copper-Nickel Alloys;Nickel; Zinc; Sequence Procedure forCopper, Lead, Iron, Nickel, and Manganesein Silicon Bronzes; Silicon and Tin; Aluminum;Phosphorus; Zinc; Sequence Procedurefor Copper, Lead, Tin, Manganese,Nickel, and Iron in Copper-Beryllium Alloys;Cobalt; Silicon and Beryllium; SequenceProcedure for Copper, Lead, Iron, Nickel,Manganese, and Zinc in Copper-ArsenicAlloys; Aluminum; Silicon and Tin; Phosphorus;Arsenic - 4. MONEL METAL AND NICKEL METAL - Sequence Procedure for Silicon, Copper,Manganese, Iron, Aluminum, and Cobalt;Sulfur; Chromium; Titanium - 5. ALUMINUM ALLOYS -Sequence Procedure for Copper, Lead, Manganese,Iron, and Nickel; Copper in SeparateSample; Iron in Separate Sample; Zinc;Silicon; Magnesium; Titanium; Chromium;Tin; Copper, Lead, and Bismuth - 6. MAGNESIUM ALLOYS -Aluminum by the Succinate Method; AluminumColorimetrically; Zinc (over 1.5%)Electrolytically; Zinc (Less than 1.5%) byH28-ZnO Method; Sequence Procedure forCopper, Iron, and Nickel; Silicon; Manganese; Tin - 7. ZINC METAL (SPELTER) - Sequence Procedure for Tin, Copper, Lead,Iron, and Aluminum; Cadmium - 8. ZINC-BASE DIE-CASTING ALLOYS - Sequence Procedure for Tin, Copper, Lead,and Iron; Cadmium; Aluminum Colorimetrically;Aluminum and Magnesium byMercury-Cathode Method - 9. CADMIUM METAL -Cadmium; Sequence Procedure for Tin, Lead,Iron, and Aluminum; Sequence Procedurefor Silver, Copper, and Bismuth; Arsenicand Antimony; Zinc - 10. TIN METAL - Sequence Procedure for Bismuth, Copper,Lead, Iron and Zinc; Antimony; Arsenic - 11. LEAD METAL -Sequence Procedure for Tin, Silver, Iron,Bismuth and Copper; Antimony and Arsenic;Zinc - 12. LEAD-BASE BEARING METAL - Lead; Tin; Antimony; Arsenic; Copper;Bismuth; Iron - 13. TIN-BASE BEARING METAL -Tin; Antimony; Arsenic; Lead; Copper;Bismuth; Iron - 14. LEAD-TIN SOLDERS - Determination of Flux (Rosin Core); Determinationof Flux (Zinc Chloride Core);Lead; Tin; Antimony; Arsenic; Copper;Bismuth; Iron - 15. SILVER SOLDERS -Sequence Procedure for Silver, Copper, Cadmiumand Zinc; Sequence Procedure for Tin,Lead, Iron, and Nickel - 16. FUSIBLE BISMUTH ALLOYS -Sequence Procedure for Bismuth, Lead, and Cadmium - Index -
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