Packaging of High Power Semiconductor Lasers

ISBN-13: 9781493955909 / Angielski / Miękka / 2016 / 402 str.

Xingsheng Liu; Wei Zhao; Lingling Xiong

Opis

This book introduces high power semiconductor laser packaging design, examining new technologies and current applications. It details challenges as well as various packaging and testing techniques.

Spis treści

Introduction of High Power Semiconductor Lasers.- Package Types of High Power Semiconductor Lasers.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress Failures: Prediction and Prevention.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Processes in Packaging of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Reliability Assessment and Failure Analysis in High Power Semiconductor Lasers.- Technology Trend and Challenges in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.

O autorze

Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.

Blurb

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.