Multichip Modules

ISBN-13: 9789810209254 / Angielski / Twarda / 1992 / 156 str.

E. S. Kuh; Ernest Kuh

Opis

Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints.