Part I: Lithography.- 1. Selective Laser Melting.- 2. Laser Processing for Metals.- 3. Electron Beam Melting.- 4. Current Research and Development.- 5. Stereolithography.- Part II: Nano/Micro Lamination.- 6. Chemical Vapor Deposition.- 7. Aqueous Solution Process.- Part III: Coating and Deposition.- 8. Aerosol Deposition Method.- 9. Cold Sprayed Metal Coatings.- 10. Cold Spray Technique.- 11. Precursor Spray.
Soshu Kirihara is a Professor of Joining and Welding Research Institute (JWRI), Osaka University, Japan. In his main investigation “Materials Tectonics”, geometric structures were successfully fabricated to modulate energy and materials flows effectively. Original stereolithography systems were developed, and a start-up company was established through academic–industrial collaboration.
Kazuhiro Nakata is a Professor Emeritus of Joining and Welding Research Institute (JWRI), Osaka University, Japan. He has innovated practical welding using arc and laser hybrid processes to realize dissimilar materials joining through interface modulations between base steel and light alloys or plastic composites. Effective surface modifications of stainless steels have been developed successfully by applying friction stirring, thermal spray, and reaction diffusion technologies.
In this book, basic sciences and applied technologies in 3D printing and 2D coating—including 2D surface modulations on 3D printed objects—are described to explore and to image novel multidimensional additive manufacturing. Renowned researchers were selected from universities and national institutes as authors by the editorial board established in the Surface Modification Research and Technology Committee of the Japan Welding Engineering Society. The main readers of this book are expected to be graduate students, professional researchers, and engineers. Here, they can acquire abundant knowledge of digital design concepts and functional evaluations, enabling them practice material selection and process parameter optimization in novel additive manufacturing.