Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

ISBN-13: 9780367573669 / Angielski / Miękka / 2020 / 322 str.

Xing-Chang Wei

Opis

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power

Spis treści

Introduction. Modal Fields of Power/Ground Planes and Grids. Integral Equation Solutions of Power Distribution Network. Via Modeling. PCB-Level EMC Controls and Designs. Interposer EMC Design. Applications of New Structures and Materials.

O autorze

Xing-Chang Wei received the Ph. D degree in electrical engineering from the Xi’an University of Electronic Science and Technology, China, in 2001. From 2001 to 2010, he was with the A*STAR Institute of High Performance Computing, Singapore, as a Research Fellow, Senior Research Engineer, and then Research Scientist. He received the 2007 Singapore Institute of Engineers Prestigious Engineering Achievement Award for his contribution to the development of a novel electromagnetic compatibility (EMC) measurement facility. In 2010, he joined Zhejiang University, Hangzhou, China, as a Full Professor, and received the New Century Excellent Talents Award from China’s Ministry of Education.

His main research interests include power integrity and signal integrity simulation and design for high-speed printed circuit boards, through interposer vias analysis, and the development of fast algorithms for computational electromagnetics. He has more than 10 years research experience in the EMC modeling and design of high-speed printed circuit boards and packaging. He has authored/co-authored more than 50 papers published in IEEE Transactions and IEEE international conferences in this area.