Foreword from the Authors ix1 Basic Principles and Components in the Microwave Techniques and Power Systems 11.1 History in Brief - From Alternating Current to Electromagnetic Waves and to Microwaves 11.2 Microwave Generators 31.3 Waveguides and Electromagnetic Modes in Wave Propagation 51.3.1 The Cut-off Frequency and the Wavelength in Waveguides 71.3.2 Waveguides Filled by Dielectrics 91.3.3 Wave Impedance and Standing Waves in Waveguides 101.3.4 Coaxial Transmission Lines 121.3.5 Microwave Resonators 141.4 Waveguide Power Lines 141.4.1 Magnetron Tube Microwave Generator 161.4.2 Microwave Insulators 161.4.3 Impedance Tuners 171.4.4 Directional Couplers 191.4.5 Passive Waveguide Components - Bends, Flanges, Vacuum Windows 201.4.6 Tapered Waveguides and Waveguide Transformers 221.4.7 Power Loads and Load Tuners 231.4.8 Waveguide Phase Shifters 251.4.9 Waveguide Shorting Plungers 251.4.10 Coupling from Rectangular to Circular Waveguide: Resonant Cavities for Generation of Plasma 261.5 Microwave Oven - A Most Common Microwave Power Device 28References 332 Gas Discharge Plasmas 372.1 Basic Understanding of the Gas Discharge Plasmas 372.2 Generation of the Plasma, Townsend Coefficients, Paschen Curve 402.3 Generation of the Plasma by AC Power, Plasma Frequency, Cut-off Density 432.4 Space-charge Sheaths at Different Frequencies of the Incident Power 502.5 Classification of Gas Discharge Plasmas, Effects of Gas Pressure, Microwave Generation of Plasmas 552.5.1 Classification of Gas Discharge Plasmas 552.5.2 Effects of the Gas Pressure on Particle Collisions in the Plasma 582.5.3 Microwave Generation of Plasmas 61References 643 Interactions of Plasmas with Solids and Gases 673.1 Plasma Processing, PVD, and PE CVD 673.2 Sputtering, Evaporation, Dry Etching, Cleaning, and Oxidation of Surfaces 723.3 Particle Transport in Plasma Processing and Effects of Gas Pressure 753.3.1 Movements of Neutral Particles 763.3.2 Movements of Charged Particles 773.3 Effect of the Gas Pressure on the Plasma Processing 793.4 Afterglow and Decaying Plasma Processing 81References 834 Microwave Plasma Systems for Plasma Processing at Reduced Pressures 854.1 Waveguide-Generated Isotropic and Magnetoactive Microwave Plasmas 854.1.1 Waveguide-Generated Isotropic Microwave Oxygen Plasma for Silicon Oxidation 874.1.2 ECR and Higher Induction Magnetized Plasma Systems for Silicon Oxidation 934.2 PE CVD of Silicon Nitride Films in the Far Afterglow 1054.3 Microwave Plasma Jets for PE CVD of Films 1114.3.1 Deposition of Carbon Nitride Films 1154.3.2 Surfajet Plasma Parameters and an Arrangement for Expanding the Plasma Diameter 1194.4 Hybrid Microwave Plasma System with Magnetized Hollow Cathode 122References 1295 Microwave Plasma Systems at Atmospheric and Higher Pressures 1355.1 Features of the Atmospheric Plasma and Cold Atmospheric Plasma (CAP) Sources 1365.2 Atmospheric Microwave Plasma Sources Assisted by Hollow Cathodes 1405.2.1 Applications of the H-HEAD Plasma Source in Surface Treatments 1445.3 Microwave Treatment of Diesel Exhaust 1515.4 Microwave Plasma in Liquids 1545.5 Microwave Plasma Interactions with Flames 1575.6 Microwave Plasmas at Very High Pressures 161References 1626 New Applications and Trends in the Microwave Plasmas 169References 1767 Appendices 1817.1 List of Symbols and Abbreviations 1817.2 Constants and Numbers 188Index 189
Ladislav Bárdoa is Professor at the Department of Electrical Engineering at Uppsala University. He received his PhD from the Institute of Plasma Physics at the Czech Academy of Sciences in 1978 and DrSc from the Charles University Prague in 1995. He was awarded the Plasma Physics Innovation Prize 2019 by the European Physical Society.Hana Baránková is Professor at the Department of Electrical Engineering, Uppsala University. She received her PhD from the Institute of Radio Engineering and Electronics at the Czech Academy of Sciences in 1981. She was awarded the Plasma Physics Innovation Prize 2019 by the European Physical Society. She is Secretary of the Board of Directors at the Society of Vacuum Coaters in the US.