Microelectronic Packaging

ISBN-13: 9780415311908 / Angielski / Twarda / 2004 / 568 str.

Madhav Datta; Tetsuya Osaka; J. Walter Schultze

Opis

Microsystem technologies using electrochemical techniques are an important development in microtechnology. This volume covers the significant area of electrochemical technologies in semiconductor manufacturing and packaging. The advances in processing technologies have led to increased performance in microelectronics and high performance transistors. There is growing interest in alternative chip-package interconnect technologies and materials that are both environmentally friendly and compatible with material changes in microchips and packages.With the advent of electrochemical processing technologies for chips metallization, there has been corresponding development of equipment compatible with semiconductor industry standards. These include high-volume manufacturing tools that are robotically controlled and operate in clean environments. This volume provides a timely and useful source of reference for graduate and postgraduate students, academic researchers and industrial technologists.

Spis treści

INTRODUCTION
Electrochemical Processing Technologies and their Impact in Microelectronic Packaging, Madhav Datta

CHIP METALLIZATION
Electroplating Process for Cu Chip Metallization, Valery M. Dubin, Harsono S. Simka, Sadasivan Shankar, Peter Moon, Thomas Marieb, and Madhav Datta

Electroless Barrier and Seed Layers for On-Chip Metallization, Valery M. Dubin, Sergey Lopatin, Amit Kohn, Nick Petrov, Moshe Eizenberg, and Yosi Shacham-Diamand

Alternative Materials for ULSI and MEMS Metallization, Yosi Shacham-Diamand, Nathan Croitoru, Alexander Inberg, Yelena Sverdlov, Valery Dubin, and Vadim Bogush

CHIP-PACKAGE INTERCONNECT
Tape Carrier and Development Trend, Osamu Yoshika, and Akira Chinda

Flip-chip Interconnection, Madhav Datta

Compliant Interconnects, Paul Kohl

Pb-free Flip-chip Technologies, D. R. Frear, and W.H. Lytle

PACKAGES AND PC BOARDS
Materials Overview in Organic Packaging, Saikumar Jayaraman, John Tang, and Vijay Wakharkar

Glass-Ceramic Packages, Kazuhiro Ikuina, Yuzo Shimada, and Kazuaki Utsumi

Electrochemical Processes in the Fabrication of Multi-chip Modules, S. Krongelb, L.T. Romankiw, E.D. Perfecto, and K.K.H. Wong

Bumping Technology for Advanced Packages, Shinichi Wakabayashi

Plated Through Hole Technology for Boards, Haruo Akahoshi

PROCESSING TOOLS
Electroplated Contact Materials for Connectors and Relays, Yutaka Okinaka

Chemical Mechanical Planarization: From Scratch to Planar, David K. Watts, Norio Kimura, and Manabu Tsujimura

Electrochemical Deposition Equipment, Tom Ritzdorf, and Dakin Fulton

Processes and Equipment for Wet Etching and Cleaning, Jeffery W. Butterbaugh

O autorze

M. Datta, Tetsuya Osaka, J. Walter Schultze