Mechanics of Microelectronics

ISBN-13: 9789048172313 / Angielski / Miękka / 2010 / 566 str.

G. Q. Zhang; W. D. Van Driel; X. J. Fan

Opis

The technology trends of Microelectronics and Microsystems are mainly characterized by miniaturization down to the nano-scale, increasing levels of system and function integration, and the introduction of new materials, while the business trends are mainly characterized by cost reduction, shorter-time-to market and outsourcing. Combination of these trends leads to increasing design complexity, dramatically decreasing design margins and process windows, reducing product development and qualification times, increasing risks of failures, and increasing difficulties to meet quality, robustness and reliability requirements. Consequentially, thermo-mechanical related failures, accounting for more than 65% of the total reliability failures, become the bottleneck for both current and future product and technology developments. From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research. Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies, covering the contents of:

• The trends in Microelectronics and Microsystems
• Reliability engineering and practices
• Thermal management
• Advanced mechanics
• Thermo-mechanics of integrated circuits and packages
• Characterization and modelling of moisture behaviour
• Characterization and modelling of solder joint reliability
• Virtual thermo-mechanical prototyping
• Challenges and future perspectives.

Recenzje

From the reviews:

"This is an introductory treatise on the mechanism of microelectronics that has penetrated into every aspects of human life for the past half of a century. ... The treatise should be of interest to both the academia and industry, and it can be used as a 'basic source for teaching' in a graduate course. ... In sum, the authors have done a valuable service in presenting the title topic to researchers, engineers and students interested in the mechanics of microelectronics." (M. Cengiz Dökmeci, Zentralblatt MATH, Vol. 1105 (7), 2007)

"The editors of Mechanics of Microelectronics present this book, as their obligation, to graduate students in universities, researchers, engineers and managers in industries. ... The book chapters are written by the worldwide leading experts with both profound theoretical achievement and rich industrial experience ... . The book will be eagerly sought after by microelectronics and microsystems design engineers; process/product development engineers; reliability engineers; thermal, mechanical and multi-physics analysts; researchers, graduates and PhD students and their guides." (Current Engineering Practice, 2007)

Spis treści

Microelectronics technology Introduction A heart of silicon In a little black box Baseline CMOS Non-CMOS options Packaging Systems Conclusions References Nomenclature Reliability practices Introduction Reliability assessment Reliability statistics Acceleration factor models Failure mechanisms Conclusions References Exercises Thermal Management Introduction Heat transfer basics Thermal design of assemblies Thermal design for a SQFP Heatsink design choices Conclusions / final remarks References Introduction to Advanced Mechanics Introduction Stress and strain Failure criteria Fracture mechanics Finite element method References Exercises Thermo-Mechanics of Integrated Circuits and Packages Introduction IC Backend and packaging processes and testing Thermo-mechanics of IC backend processes Thermo-Mechanics of packaging processes Thermo-Mechanics of coupled IC backend and packaging processes Case studies References Exercises Characterization and Modeling of Moisture Behavior Introduction Moisture diffusion modeling Characterization of moisture diffusivity and saturation concentration Vapor pressure modeling Hygroscopic swelling characterization & modeling Single void Instability behavior Subjected to vapor pressure and thermal stress Interface strength characterization and modeling Case studies References Exercises Characterization and Modeling of Solder Joint Reliability Introduction Analytical-empirical prognosis of the reliability Thermo-mechanical characteristics of soft solders Data evaluation and LIFE-time estimation Case studies References Exercises Virtual thermo-mechanical prototyping Introduction The state-of-the-art of virtual prototyping Case studies Conclusions References Exercises Challenges and future perspectives Introduction Product and process inputs Tests and experiments Multi-scale mechanics Advanced simulation tools Multi-physics modeling Material and interface behavior Simulation-based optimization Conclusions