Mechanical Analysis of Electronic Packaging Systems

ISBN-13: 9780367399818 / Angielski / Miękka / 2019 / 374 str.

McKeown

Opis

"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

Spis treści

Analytical tools; thermal performance analysis; mechanical performance analysis; life analysis; other analysis; analysis of test data; reporting and verification.

O autorze

Mckeown,