Introduction to Microsystem Packaging Technology

ISBN-13: 9781138374256 / Angielski / Miękka / 2018 / 232 str.

Yufeng Jin;Zhiping Wang;Jing Chen

Opis

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems.Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturingThe authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection.With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

Spis treści

Introduction. Design Technique for Microsystems Packaging and Integration. Substrate Technology. Interconnection Technology. Device Level Package. MEMS Packaging. Module Assembly and Optoelectronic Packaging. System Level Packaging Technology. Reliability. Prospects for Microsystems Packaging Technology. References.