Interconnects in VLSI Design

ISBN-13: 9780792379973 / Angielski / Twarda / 2000 / 236 str.

Hartmut Grabinski

Opis

This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua- tion and a supplement to the first book "Signal Propagation on Interconnects," Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des- cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.

Spis treści

Foreword; H. Grabinski. Recent Development in Interconnect Modeling; J.M. Wang, E.S. Kuh. Study of Parallel Plane Mode Excitation at a Double-Layer Via Interconnect Using the FDTD Method; C. Schuster, W. Fichtner. A Testchip for Analysis of Signal Integrity and Ground-Bounce Effects in Deep-Submicron Technology; T. Steinecke. Measurement of Signal Integrity within Deep-Submicron Interconnect; F. Caignet, et al. Considering Magnetic Interference in Board-Level Interconnect Design; G. Müller, K. Reiß. Input Shape Influence over Interconnect Performances; L.B. Kenmei, et al. Comparison of RL and RLC Interconnect Models in the Simultaneous Switching Noise Simulations; S. Hasan, et al. Black-Box Modeling of Digital Devices; I.S. Stievano, et al. Advanced Modeling of Nonuniform Interconnects; S. Grivet-Talocia, et al. Modeling of Passive Components for Radio Frequency Applications; J. Lescot, et al. Electrical Performance of Capacitors Integrated in Multi-Layered Printed Circuit Boards; A. Madou, L. Martens. Characteristic Impendance Measurement on Silicon; U. Arz, et al. Efficient Computation of the Parameters of Parallel Transmission Lines in IC Interconnects; M. Grimm, et al. Modeling of Optical Interconnections for Data Transmission within High-Speed Electronic Systems; A. Wallrabenstein, et al. Quantifying the Impact of Optical Interconnect Latency on the Performance of Optoelectronic FPGA's; J. Dambre, et al. PIN CMOS Receivers for Optical Interconnects; H. Zimmermann, et al. BICMOS Receiver OEIC for Optical Interconnect; K. Kieschnick, et al. Electrical/Optical Circuit Boards: Technology - Design - Modeling; E. Griese, et al.