Integrating Carbon Nanotubes as Future Device Interconnects » książka
Integrating Carbon Nanotubes as Future Device Interconnects
ISBN-13: 9783845405247 / Angielski / Miękka / 2011 / 100 str.
Carbon Nanotubes (CNTs) are promising materials for future device interconnects due to their high electrical conductivity owing to their one-dimensional structure, and high current carrying capacity. However, many challenges exist for their integration in usable devices. This book covers research in addressing some of these challenges. This book starts off with challenges involved in their synthesis over different substrates materials and geometries. Subsequently, this book studies the structure - property relations of individual CNTs and their arrays. Groundbreaking results on inter-shell conduction as novel methods to improve electrical properties of individual multi-walled CNT has been discussed in detail.
Carbon Nanotubes (CNTs) are promising materials for future device interconnects due to their high electrical conductivity owing to their one-dimensional structure, and high current carrying capacity. However, many challenges exist for their integration in usable devices. This book covers research in addressing some of these challenges. This book starts off with challenges involved in their synthesis over different substrates materials and geometries. Subsequently, this book studies the structure - property relations of individual CNTs and their arrays. Groundbreaking results on inter-shell conduction as novel methods to improve electrical properties of individual multi-walled CNT has been discussed in detail.
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