Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach

ISBN-13: 9780367400972 / Angielski / Miękka / 2019 / 336 str.

Pradeep Lall; Michael G. Pecht; Edward B. Hakim

Opis

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures.

Spis treści

Chapter 1 Temperature as a Reliability Factor, Chapter 2 Temperature Dependence of Microelectronic Package Failure Mechanisms, Chapter 3 Temperature Dependence of Microelectronic Package Failure Mechanisms, Chapter 4 Electrical Parameter Variations in Bipolar Devices, Chapter 5 Electrical Parameter Variations in MOSFET Devices, Chapter 6 a Physics-of-failure Approach to IC Burn-In, Chapter 7 Derating Guidelines for Temperature-tolerant Design of Microelectronic Devices, Chapter 8 Derating Guidelines for Temperature-tolerant Design of Electronic Packages, Chapter 9 Conclusions, References, Index, Permissions

O autorze

Pradeep Lall, Michael G. Pecht, Edward B. Hakim