Implantable Neural Prostheses 2: Techniques and Engineering Approaches

ISBN-13: 9780387981192 / Angielski / Twarda / 2009 / 371 str.

David Zhou; Elias Greenbaum

Opis

Signi?cant progress has been made in the development of neural prostheses for restoration of human functions and improvement of the quality of life. Biomedical engineers and neuroscientists around the world are working to improve the design and performance of existing devices and to develop novel devices for arti?cial vision, arti?cial limbs, and brain-machine interfaces. This book, Implantable Neural Prostheses 2: Techniques and Engineering Approaches, is part two of a two-volume sequence that describes state-of-the-art advances in techniques associated with implantable neural prosthetic devices. The techniques covered include biocompatibility and biostability, hermetic packaging, electrochemical techniques for neural stimulation applications, novel electrode materials and testing, thin-?lm ?exible microelectrode arrays, in situ char- terization of microelectrode arrays, chip-size thin-?lm device encapsulation, microchip-embedded capacitors and microelectronics for recording, stimulation, and wireless telemetry. The design process in the development of medical devices is also discussed. Advances in biomedical engineering, microfabrication technology, and neu- science have led to improved medical-device designs and novel functions. However, many challenges remain. This book focuses on the engineering approaches, R&D advances, and technical challenges of medical implants from an engineering p- spective. We are grateful to leading researchers from academic institutes, national laboratories, as well as design engineers and professionals from the medical device industry who have contributed to the book. Part one of this series covers designs of implantable neural prosthetic devices and their clinical applications.

Recenzje

From the book reviews:

"It is my pleasure to highly recommend this book for a comprehensive discussion of cortical, optic nerve, lateral geniculate, and retinal prostheses as it relates to vision and hearing. ... I recommend this book highly for engineers, students, fellows and investigators at advanced levels." (Joseph J. Grenier, Amazon.com, December, 2014)

Spis treści

The Biocompatibility and Biostability of New Cardiovascular Materials and Devices.- Technology Advances and Challenges in Hermetic Packaging for Implantable Medical Devices.- Science and Technology of Bio-Inert Thin Films as Hermetic-Encapsulating Coatings for Implantable Biomedical Devices: Application to Implantable Microchip in the Eye for the Artificial Retina.- The Electrochemistry of Charge Injection at the Electrode/Tissue Interface.- In Situ Characterization of Stimulating Microelectrode Arrays: Study of an Idealized Structure Based on Argus II Retinal implants.- Thin-Film Microelectrode Arrays for Biomedical Applications.- Stimulation Electrode Materials and Electrochemical Testing Methods.- Conducting Polymers in Neural Stimulation Applications.- Microelectronics of Recording, Stimulation, and Wireless Telemetry for Neuroprosthetics: Design and Optimization.- Microchip-Embedded Capacitors for Implantable Neural Stimulators.- An Effective Design Process for the Successful Development of Medical Devices.

Blurb

This book and its companion volume describe state-of-the-art advances in techniques associated with implantable neural prosthetic devices and their applications. They offer researchers, engineers, clinicians, students and any specialists in this field a deeper understanding of the neural prosthetic techniques currently available for a wide range of biomedical applications.

In part two of this two-volume sequence, Implantable Neural Prostheses: Techniques and Engineering Approaches, the focus is on general techniques, platforms, and engineering approaches in research and development. Coverage includes biocompatibility, electrode materials and testing, electrochemical techniques for neural stimulation applications, thin-film electrode arrays, hermetic and thin-film packaging, and microelectronics for recording, stimulation and wireless telemetry. Also discussed is the design process in the development of medical devices.