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Kategorie szczegółowe BISAC

High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials

ISBN-13: 9780387982205 / Angielski / Miękka / 1997 / 444 str.

Bongtae Han; P. Ifju; B. Han
High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials Post, Daniel 9780387982205 Springer - książkaWidoczna okładka, to zdjęcie poglądowe, a rzeczywista szata graficzna może różnić się od prezentowanej.

High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials

ISBN-13: 9780387982205 / Angielski / Miękka / 1997 / 444 str.

Bongtae Han; P. Ifju; B. Han
cena 201,24
(netto: 191,66 VAT:  5%)

Najniższa cena z 30 dni: 192,74
Termin realizacji zamówienia:
ok. 22 dni roboczych.

Darmowa dostawa!

Mechanical engineering, an engineering discipline born of the needs of the industrial revolution, is once again asked to do its substantial share in the call for industrial renewal. The general call is urgent as we face profound issues of productivity and competitiveness that require engineering solutions, among oth ers. The Mechanical Engineering Series features graduate texts and research monographs, intended to address the need for information in contemporary areas of mechanical engineering. The series is conceived as a comprehensive one the will cover a broad range of concentrations important to mechanical engineering graduate education and research. We are fortunate to have a distinguished roster of consulting editors, each an expert in one of the areas of concentration. The names of the consulting editors are listed on the first page of the volume. The areas of concentration are applied mechanics, biomechanics, computational mechanics, dynamic systems and control, energetics, mechanics of materials, processing, thermal science, and tribology. Professor Winer, the consulting editor for applied mechanics and tribology, and I are pleased to present this volume of the series: High Sensitivity Moire: Experimental Analysis for Mechanics and Materials by Professor Post, Dr. Han and Dr. Ifju. The selection of this volume underscores again the interest of the Mechanical Engineering Series to provide our readers with topical monographs as well as graduate texts."

Kategorie:
Technologie
Kategorie BISAC:
Technology & Engineering > Mechanical
Technology & Engineering > Materials Science - General
Science > Physics - Condensed Matter
Wydawca:
Springer
Język:
Angielski
ISBN-13:
9780387982205
Rok wydania:
1997
Wydanie:
Study
Numer serii:
000287593
Ilość stron:
444
Waga:
1.44 kg
Wymiary:
23.5 x 15.5
Oprawa:
Miękka
Wolumenów:
01
Dodatkowe informacje:
Wydanie ilustrowane

1 Introduction.- 1.1 Our Subject.- 1.2 Scope and Style.- 1.3 History.- 1.4 Comment on Exercises.- 1.5 References.- I.- 2 Elements of Optics.- 2.1 The Nature of Light.- • More Details.- • Metallic Reflection.- • Dielectric Reflection.- • Refraction.- 2.2 Optical Elements.- • Light Sources.- • Wedges, Prisms, Mirrors.- • Partial Mirrors.- • Antireflection Coatings.- • Lenses.- • Laser-beam Expander, Spatial Filter, Optical Fibers.- • Parabolic Mirrors.- 2.3 Coherent Superposition.- • Pure Two-beam Interference.- • Conservation of Energy.- • Impure Two-beam Interference.- • Fringe Patterns and Walls of Interference.- • Warped Wave Fronts.- • The Camera.- • Two-beam Interferometers.- • Derivation of the Interference Equations.- • Interference with Broad Spectrum Light.- 2.4 Superposition of Incoherent Light Waves.- 2.5 Diffraction Gratings and Diffraction.- • Wave Fronts and Optical Path Lengths.- • Equivalency and Virtual Gratings.- • Self-imaging of Gratings.- 2.6 References.- 2.7 Key Relationships.- 2.8 Exercises.- 3 Geometric Moiré.- 3.1 Basic Features of Moiré.- • Gratings, Fringes, Visibility.- • Intensity Distribution.- • Multiplicative and Additive Intensities.- • Pure Rotation and Extension.- • Moiré Fringes as Parametric Curves.- • Fringe Vectors.- • Amplification by Moire.- • Fringe Sharpening and Multiplication.- • Circular Gratings.- 3.2 In-plane Displacements of a Deformed Body.- • Physical Concepts, Absolute Displacements.- • Practical Example, Relative Displacements.- • Mismatch Fringes (Carrier Fringes).- • Fringe Shifting.- 3.3 Out-of-plane Displacements.- • Shadow Moiré.- • Projection Moiré.- • Comparison.- 3.4 References.- 3.5 Key Relationships.- 3.6 Exercises.- 4 Moiré Interferometry.- 4.1 Introduction.- 4.2 A More Rigorous Explanation.- 4.3 Mathematical Analysis.- • Implications of the Analysis.- 4.4 The Virtual Reference Grating Concept.- 4.5 Theoretical Limit.- 4.6 Sensitivity and Resolution.- 4.7 Optical Systems for Moiré Interferometry.- • Alignment.- • Size of Field.- • Environmental Concerns: Air Currents.- • Vibrations, Optical Tables.- • Loading Fixtures.- • Two-beam Systems.- • Four-beam Systems.- • Achromatic Systems.- • Three-beam Interferometer.- • ±45° Gratings.- 4.8 Transmission Systems.- 4.9 Specimen Gratings.- • Replication.- • The Mold.- • Alignment of Specimen Gratings.- • Curved Surfaces.- • Zero-thickness Gratings and High-temperature Gratings.- 4.10 Fringe Counting.- • Sign of Fringe Gradient: Experimental Method.- 4.11 Strain Analysis.- 4.12 In-plane Rigid-body Rotations.- 4.13 Carrier Fringes.- 4.14 Fringe Vectors.- 4.15 Anomalies and Subtraction of Uniform Gradients.- 4.16 Two-body Problems, Bridges.- 4.17 Coping with the Initial Field.- 4.18 Optical Filtering.- 4.19 Sensitivity to Out-of-plane Motion.- • Black Holes and Out-of-Plane Slopes.- 4.20 Coping with Vibrations.- 4.21 Variations of Moiré Interferometry.- • Replication of Deformed Specimen Gratings.- • Replication for Thermal Strains.- • Moiré Fringe Multiplication.- • Multiplication by One.- 4.22 Mechanical Differentiation.- 4.23 Comments on Data Analysis.- 4.24 Shear Lag and the Thickness of Specimen Gratings.- 4.25 References.- 4.26 Key Relationships.- 4.27 Exercises.- 5 Microscopic Moiré Interferometry: Very High Sensitivity.- 5.1 Introduction.- • Scope and Summary.- 5.2 The Immersion Interferometer.- • Sensitivity in a Refractive Medium.- • Optical Configurations.- • Four-beam Immersion Interferometer.- 5.3 Optical/Digital Fringe Multiplication.- • Fringe Shifting.- • Fringe Sharpening and Multiplication: Physical Analysis.- • Mathematical Analysis.- • Implications of the Analyses.- 5.4 Shear Lag and Grating Thickness.- 5.5 References.- 5.6 Exercises.- 6 On the Limits of Moiré Interferometry.- 6.1 Introduction.- 6.2 Warped Wave Front Model.- 6.3 Fourier Wave Front Model.- 6.4 Strain Fields.- 6.5 Boundary Effects, Discontinuities.- 6.6 Spatial Resolution.- 6.7 Displacement Resolution.- 6.8 Strain and Gage Length.- • Strain Resolution.- 6.9 Dynamic Range.- 6.10 Absolute Accuracy.- 6.11 Summary.- 6.12 References.- II.- 7 Laminated Composites in Compression: Free-edge Effects.- 7.1 Introduction.- 7.2 In-plane Compression, Quasi-isotropic Specimen.- • Carrier Fringes.- 7.3 In-plane Compression, Cross-ply Specimen.- 7.4 Interlaminar Compression, Quasi-isotropic Specimen.- 7.5 Interlaminar Compression, Cross-ply Specimen.- • Out-of-plane Displacements.- • Normal Strains ex, Microscopic Study.- 7.6 References.- 7.7 Exercises.- 8 Thermal Stresses Near the Interface of a Bimaterial Joint.- 8.1 Introduction.- 8.2 The Experiments.- • Experimental Method.- • Relationships and Notation.- • Elevated Temperature Replication.- • Extracting the Coefficients of Expansion.- 8.3 Stress Analysis.- • ?y within the Interface Zone.- 8.4 Experiments by Microscopic Moiré Interferometry.- 8.5 Comments.- 8.6 References.- 8.7 Exercises.- 9 Textile Composites.- 9.1 Introduction.- 9.2 Woven Textile Composites.- • Data Reduction and Results.- 9.3 Braided Textile Composites.- 9.4 Open Hole Tension.- 9.5 Compact Moiré Interferometer.- 9.6 References.- 9.7 Exercises.- 10 Thermal Deformations in Electronic Packaging.- 10.1 Introduction.- 10.2 Grating Replication.- 10.3 Controlled-Collapse Chip Connection (C4).- • Ceramic Chip Carrier.- • Organic Chip Carrier.- 10.4 Solder Ball Connection.- 10.5 Low Temperature Application.- • Replication of Deformed Grating.- 10.6 Coefficient of Thermal Expansion.- 10.7 References.- 10.8 Exercises.- 11 Advanced Composites Studies.- 11.1 Introduction.- 11.2 Ceramic Composites.- • Delamination of Specimen Gratings.- 11.3 Creep.- 11.4 Metal-Matrix Composite.- 11.5 Residual Stresses.- 11.6 Thermal Strains, Residual Strains.- • Micromechanics:.- • Thermal Deformation of Boron/Aluminum.- 11.7 Simulation.- 11.8 Wavy Plies.- 11.9 References.- 11.10 Exercises.- 12 Metallurgy, Fracture, Dynamic Loading.- 12.1 Introduction.- 12.2 Metallurgy.- • Elastic-plastic Joint.- • Weld Defects.- • Micromechanics: Grain Deformations.- • Tube-plate Joints.- 12.3 Fracture.- • Plastic Wake, Damage Wake.- • The J Integral.- • Micromechanics: Crack Arrest.- • Interior Strains, Stress Freezing.- 12.4 Dynamic Moiré Interferometry.- • Equipment.- • Wave Propagation in a Composite Laminate.- 12.5 References.- 12.6 Exercises.- 13 Strain Standard for Calibration of Electrical Strain Gages.- 13.1 Introduction.- • The Calibration Factor.- 13.2 The Specimen Grating.- 13.3 Apparatus and Basic Procedure.- • The Interferometer.- • Experimental Procedure: Basic Description.- • The Optical System.- 13.4 Tuning the Optical System.- • Symmetry.- • Circulation.- • Specimen Plane.- • Collimation.- 13.5 Mechanical Systems.- • Method of Attachment.- • Fringe Shifting Device.- • Beam Deflection Device.- 13.6 Calibration of the Specimen Grating.- 13.7 Strain Gage Instrumentation.- 13.8 Systematic Errors, Uncertainties.- • Additional Considerations.- 13.9 The Experiment: Data Sequence, Computations and Results.- 13.10 Accuracy.- 13.11 Gage Factor Measurements.- 13.12 Future Refinements.- 13.13 References.- 13.14 Exercises.- Appendices.- A Shadow Moiré with Enhanced Sensitivity.- A.1 Introduction.- A.2 Shadow Moiré with O/DFM.- A.3 In-plane Geometric Moiré with O/DFM.- A.4 Reference.- B Submaster Grating Molds.- B.1 Introduction.- B.2 Production of Silicone Rubber Submasters.- B.3 Production of Epoxy Submasters.- B.4 Application of the Reflective Film.- B.5 References.- C Adhesives for Replication of Specimen Gratings.- C.1 Adhesives.- C.2 Addresses.



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