High Performance Design Automation for Multi-Chip Modules and Packages

ISBN-13: 9789810223076 / Angielski / Twarda / 1996 / 264 str.

Jun Dong Cho; Paul D. Franzon

Opis

The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment.