Handbook of Thick- And Thin-Film Hybrid Microelectronics

ISBN-13: 9780471272298 / Angielski / Twarda / 2003 / 424 str.

Tapan Gupta

Opis

This is the first handbook on the fabrication and design of hybrid microelectronic circuits.
* Deals with all aspects of the technology, design, layout and processing of materials.
* Fills the need for a comprehensive survey of a widely-used technology.

Recenzje

"…this handbook provides standard reference material for the hybrid microelectronics area, with a level of detail consistent with a handbook." ( MRS Bulletin, April 2005)

"This book gives thorough coverage of these subjects; the descriptions are up to date, and cover the fundamentals, so the book should be useful for some time to come." (IEEE Electrical Insulation Magazine, November/December 2004)

Spis treści

Preface.

1– Introduction.

2– Mathematical Foundations Circuit Design, and Layout Rules for Hybrid Microcircuits.

3– Computer–Aided Design and Pattern Generation Techniques.

4– Thick–Film Fundamentals.

5– Thick–Film Deposition Techniques.

6– Thin–Film Fundamentals.

7– Thin–Film Deposition Techniques.

8– Component Assembly and Interconnections.

9– Adjustment of Passive Components.

10– Packaging and Thermal Considerations.

11– Multichip Module and Microwave Hybrids Circuits.

Glossary.

Index. 

O autorze

TAPAN K. GUPTA, PhD, received an MA in Physics from Indian Institute of Technology, a PhD in Physics from Boston College, and was a Post Doctoral Fellow in the Electrical Engineering and Communication Department at Lehigh University. A former Analog Devices Career Development professor in the Electrical Engineering Department at Tufts University, Dr. Gupta is currently a senior research scientist in the advanced materials group at Radiation Monitoring Devices, MA. He is also responsible for the synthesis and characterization of new materials and their applications in nuclear medicine at the Massachusetts Institute of Technology, Cambridge, MA. Dr. Gupta has authored a book chapter on solar cells and materials for Allied Publications, New Delhi, and more than forty–five peer–reviewed articles in the field of physics, material science, and semiconductor physics.

Blurb

Thick and thin film hybrid microelectronics has revolutionized the microelectronics industry. Its flexibility, cost–effectiveness, programmability, precision, and broad range of applications–from cell phones to laptops–make this the technology of the future. Industry experts predict that in a few years, almost everything from shoes to windows to children’s toys will integrate microelectronics.

Handbook of Thick and Thin Film Hybrid Microelectronics is the definitive source of detailed information on all the important topics in modern hybrid microelectronics. This academically rigorous handbook presents a comprehensive treatment of materials, their characteristics, and their field of applications. Useful as a standard desk reference for professionals and as a textbook for students, this book provides insights into:

• Circuit design, layout, and fabrication of hybrid electronic circuits
• Both high and low frequency applications
• Packaging and thermal considerations
• Microwave integrated circuits
• Electronic materials and the engineering aspects of the multichip module (MCM)
• Application procedures for thick and thin films