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Kategorie szczegółowe BISAC

Handbook of Machining with Grinding Wheels, Second Edition

ISBN-13: 9780367868703 / Angielski / Miękka / 2019 / 724 str.

Ioan D. Marinescu; Mike P. Hitchiner; Eckart Uhlmann
Handbook of Machining with Grinding Wheels, Second Edition Ioan D. Marinescu Mike P. Hitchiner Eckart Uhlmann 9780367868703 CRC Press - książkaWidoczna okładka, to zdjęcie poglądowe, a rzeczywista szata graficzna może różnić się od prezentowanej.

Handbook of Machining with Grinding Wheels, Second Edition

ISBN-13: 9780367868703 / Angielski / Miękka / 2019 / 724 str.

Ioan D. Marinescu; Mike P. Hitchiner; Eckart Uhlmann
cena 476,99
(netto: 454,28 VAT:  5%)

Najniższa cena z 30 dni: 463,39
Termin realizacji zamówienia:
ok. 22 dni roboczych
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Grinding offers capabilities that range from high-rate material removal to high-precision superfinishing and has become one of the most widely used industrial machining and surface finishing operations. Reflecting modern developments in the science and practice of grinding, this handbook presents a broad range of abrasive machining technologies

Kategorie:
Technologie
Kategorie BISAC:
Technology & Engineering > Technical & Manufacturing Industries & Trades
Science > Mechanics - General
Technology & Engineering > Manufacturing
Wydawca:
CRC Press
Język:
Angielski
ISBN-13:
9780367868703
Rok wydania:
2019
Ilość stron:
724
Waga:
1.27 kg
Wymiary:
25.4 x 17.78 x 3.81
Oprawa:
Miękka
Wolumenów:
01
Dodatkowe informacje:
Glosariusz/słownik

"It is a comprehensive book which deals with almost all important aspects of theory and practice of different types of grinding operations and applications. It also describes in detail, grinding machines hence it becomes useful for researchers, teachers as well as practicing engineers."
—Dr. V. K. Jain, Mechanical Engineering Department, I.I.T. Kanpur, India

THE BASIC PROCESS OF GRINDING. Introduction. Grinding Parameters. Material Removal Mechanisms. Grinding Wheels. The Nature of the Abrasive. Specification of the Bond. Dressing. Grinding Dynamics. Grinding Wheel Wear. Coolants, the Coolant System, and Cooling. Monitoring of Grinding Processes. Economics of Grinding. APPLICATION OF GRINDING PROCESSES. Grinding of Ductile Materials. Grinding of Ceramics. Grinding Machine Technology. Surface Grinding. External Cylindrical Grinding. Internal Grinding. Centerless Grinding. Ultrasonic-Assisted Grinding. Glossary. Appendix: Notation and Use of SI Units.

Brian Rowe is considered the father of centerless grinding in addition to other notable research on grinding that includes thermal aspects, dynamic aspects, and fluid-film bearings. He established a laboratory and school dedicated to manufacturing processes at Liverpool John Moores University and is an Emeritus Professor.



Ichiro Inasaki is the dean of the Graduate School of Science and Technology at Keio University, Japan. He has developed a laboratory with outstanding research activities and his "intelligent grinding wheel" is featured in the Noritake Museum and represents one of his best accomplishments and contributions. He led CIRP in 2004/2005 as the president and was granted several awards.



Eckart Uhlmann is professor and director of the Institute for Machine-Tools and Management at Technical University of Berlin, Germany. Dr. Uhlmann received this chaired professorship after a very successful industrial career with Hermes Abrasive in Germany. As the head of his institute he holds the leading position in research on all aspects of abrasive machining with grinding wheels.



Dr. Mike Hitchiner is manager of precision technology at Saint Gobain Abrasives (Norton), the largest grinding wheel company in the world. Mike has devoted all his life to research, development and practical application of grinding processes. He started this activity during his D Phil at the University of Oxford in England, and was later considered "Mr. CBN Grinding" by the precision grinding industry. Today he focuses on working with machine tool builders and developing new grinding processes. He has brought an important industrial perspective to this book, as well as hundreds of applications.



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