From LED to Solid State Lighting

ISBN-13: 9781118881477 / Angielski / Twarda / 2021 / 256 str.

S. W. Ricky Lee; Jeffery C. C. Lo

Spis treści

Preface vAbout the Authors vii1 LEDs for Solid-State Lighting 11.1 Introduction 11.2 Evolution of Light Sources and Lighting Systems 11.3 Historical Development of LEDs 61.4 Implementation of White Light Illumination with an LED 81.5 LEDs for General Lighting 10References 122 Packaging of LED Chips 152.1 Introduction 152.2 Overall Packaging Process and LED Package Types 162.3 Chip Mounting and Interconnection 202.4 Phosphor Coating and Dispensing Process 382.5 Encapsulation and Molding Process 482.6 Secondary Optics and Lens Design 50References 543 Chip Scale and Wafer Level Packaging of LEDs 613.1 Introduction 613.2 Chip Scale Packaging 633.3 Enabling Technologies forWafer Level Packaging 663.4 Designs and Structures of LED Wafer Level Packaging 913.5 Processes of LED Wafer Level Packaging 96References 1064 Board Level Assemblies and LED Modules 1114.1 Introduction 1114.2 Board Level Assembly Processes 1124.3 Chip-on-Board Assemblies 1304.4 LED Modules and Considerations 137References 1415 Optical, Electrical, and Thermal Performance 1455.1 Evaluation of Optical Performance 1455.2 Power Supply and Efficiency 1595.3 Consideration of LED Thermal Performance 163References 1726 Reliability Engineering for LED Packaging 1756.1 Concept of Reliability and Test Methods 1756.2 Failure Analysis and Life Assessment 1816.3 Design for Reliability 185References 1877 Emerging Applications of LEDs 1897.1 LEDs for Automotive Lighting 1897.2 Micro- and Mini-LED Display 1947.3 LED for Visible Light Communication 203References 2088 LEDs Beyond Visible Light 2138.1 Applications of UV-LED 2138.2 Applications of IR-LEDs 2258.3 Future Outlook and Other Technology Trends 233References 235Index 243

O autorze

Shi-Wei Ricky Lee, PhD, received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University in 1992. Currently he is Chair Professor of Mechanical and Aerospace Engineering and Director of Foshan Research Institute for Smart Manufacturing at the Hong Kong University of Science and Technology (HKUST).Jeffery C. C. Lo, PhD, received his Bachelor (1st Class Honour) and MPhil degrees in Mechanical Engineering from the Hong Kong University of Science and Technology (HKUST) in 2002 and 2004 respectively. He is currently the Program Manager at the Center for Advanced Microsystems Packaging at HKUST and Assistant Director of FRISM.Mian Tao, PhD, received his MSc degree from the Hong Kong University of Science and Technology (HKUST) in Mechanical Engineering in 2010 and PhD degree in 2016. His research interests include thermal characterization and management of high power electronics and development of advanced microelectronic packages.Huaiyu Ye, PhD, received his PhD degree from the Department of Microelectronics, Delft University of Technology in 2014. Currently he is Associate Professor of Southern University of Science and Technology (SUSTech).