Foldable Flex and Thinned Silicon Multichip Packaging Technology

ISBN-13: 9780792376767 / Angielski / Twarda / 2003 / 347 str.

John W. Balde; John W. Balde

Opis

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Much of the work in this field has not been widely disseminated other than by papers presented at conferences and workshops. This book is organized to report on the developments in this technology, but with special additional material and emphasis. The intent is to do more than report on present state of the art. It is intended as an advocacy book, pointing out the reasons for 3-D assemblies, the reasons for Silicon-in-a-Package multichip modules, and the commercial availability of the techniques. The contributing authors, all leaders in this technical field, explore the needs, reveal the state of development and production, and point to changes in technology that can bring this technology into wider use for more complex applications. It is an advocacy book in this respect - advocacy for the use of a technology that is already mature, and advocacy for exploring ways to make it even more capable for the future. It will also do more than discuss the present; it will point out the deficiencies of the constructions, the needed availability of good flex material, the use of newer flex materials, such as LCP, and the implications from the use of the Integrated Mesh Power Systems to enhance the capability for future designs. Lastly it will discuss the serious problem of heat removal if multiple microprocessors are included.

Recenzje

"If you are responsible for deciding on the next generation of packaging that will be used for your company's application or are steering university research and want to find high impact focus, this book is a must read....By placing all this information between two covers and having the various perspectives of the many authors clash and add to each other (and providing access to the authors), the reader is placed in a knowledgeable position from which to make their own technology investment decisions in this 3D world."
(David W Palmer, Manager Microsystems Applications, Sandia National Laboratories)

Spis treści

Contributor List. About IMAPS; P. Barnwell, President, IMAPS. Introduction; J. Balde. 1. 3-D Assemblies of Stacked Chips and other Thin Packages; J. Balde. 2. Multi-Chip Carriers in a System-on-a-Chip World; E. Davidson. 3. Packaging Technologies for Flexible Systems; C. Kallmayer. 4. Low Profile and Flexible Electronic Assemblies Using Ultra-Thin Silicon - The European Flex-Si Project; T. Harder. 5. Thin Chips for Flexible and 3-D Integrated Electronic Systems; K. Bock, M. Feil, C. Landesberger. 6. Flexible Microarray Interconnection Techniques Applied to Biomedical Microdevices; J.-U. Meyer, M. Schuetter, O. Scholz, W. Haberer, T. Steiglitz. 7. Folded Flex and other Structures for System-in-a Package; M. Warner, W. Carlson. 8. Valtronic CSP3D Technology; G. Rochat, P. Clot, J.-F. Zeberti. 9. 3-D Packaging Technologies: Are Flex based Solutions the Answer? T. Tessier. 10. Availability of High Density Interconnect Flexible Circuits; E.J. Vardaman, D. Numakura. 11. Recent Advances in Flexible Circuit Technology Using Liquid Crystal Polymer Substrates; Rui Yang, T.F. Hayden. 12. Flex and the Interconnected Mesh Power System (IMPS); L.W. Schaper. 13. Thermal Management and Control of Electromagnetic Emissions; C. Zweben. Conclusions; J. Balde. Authors' Biographies. Index.