Failure Modes and Mechanisms in Electronic Packages

ISBN-13: 9781461377634 / Angielski / Miękka / 2012 / 370 str.

P. Singh; Puligandla Viswanadham

Opis

With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.

Spis treści

Introduction. Electronic packaging. Why failures occur. Failure detection. Failure analysis. Failure modes. Failure mechanisms. Failure models. Failure preventions. Summary. Appendices. References.