ISBN-13: 9783030894689 / Angielski / Miękka / 2022 / 311 str.
ISBN-13: 9783030894689 / Angielski / Miękka / 2022 / 311 str.
Contents
1. Electrical Resistance Strain Gages
1.1 Introduction1.2 Basic Principle
1.3 Bonded Resistance Strain Gages
1.4 Transverse Sensitivity and Gage Factor
1.5 Electrical Circuits
1.5.1 Introduction
1.5.2 The potentiometer Circuit
1.5.3The Wheatstone Bridge
1.6 Strain Gage Rosettes
2. Fundamentals of optics
2.1 Introduction
2.2 Historical Overview
2.3 Light Sources, Wave Fronts, and Rays2.4 Reflection and Mirrors
2.4.1 Reflection
2.4.2 Plane Mirrors
2.4.3 Spherical Mirrors
2.5 Refraction2.6 Thin Lenses
2.7 The Wave Nature of light – Huygens’ Principle
2.8 Electromagnetic Theory of Light
2.9 Polarization
2.10 Interference
2.10.1 Introduction
2.10.2 Interference of Two Linearly Polarized Beams
2.10.3 Young’s Double-Slit Experiment
2.10.4 Multi-slit interference
2.10.5 Interference of Two Plane Waves
2.10.6 Change of Phase Upon Reflection – Thin films
2.10.7 Dispersion
2.11 Diffraction
2.11.1 Introduction
2.11.2 Single Slit Diffraction
2.11.3 Two Slit Diffraction
2.11.4 The diffraction grating
2.11.5 Diffraction by a Circular Aperture
2.11.6 Limit of Resolution
2.11.7 Fraunhofer Diffraction as a Fourier Transform
2.11.8 Optical Spatial Filtering
2.11.9 The Pinhole Spatial Filter
3. Geometric Moiré
3.1 Introduction
3.2 Terminology
3.3 The Moiré Phenomenon
3.4 Mathematical Analysis of Moiré Fringes
3.5. Relationships Between Line Grating and Moiré Fringes
3.6 Moiré Patterns Formed by Circular, Radial and Line Gratings
3.7 Measurement of In-Plane Displacements
3.8 Measurement of Out-of-Plane Displacements
3.9 Measurement of Out-of-Plane Slopes
3.10 Sharpening of Moiré Fringes3.11 Moiré of Moiré
4. Coherent Moiré and Moiré Interferometry
4.1 Introduction
4.2 Superposition of Two Diffraction Gratings
4.3 Moiré Patterns
4.4 Optical Filtering and Fringe Multiplication.
4.5 Advantages Offered by Coherent Moiré4.6 Moiré Interferometry
4.6.1 Introduction
4.6.2 Optical Arrangement
4.6.3 The method
4.6.4 Determination of strains
5. Moiré patterns formed by remote gratings
5.1 Introduction
5.2 Geometric Moiré Methods
5.2.1 Introduction
5.3 The coherent Grading Sensing (CGS) Method5.3.1 Introduction
5.3.2 Experimental Arrangement
5.3.3 Governing Equations
6. The method of caustics
6.1 Introduction
6.2 Governing Equations for Reflective Surfaces
6.3 The Ellipsoid Mirror
6.4 Intensity of a Light ray Illuminating a Transparent Specimen
6.5 Stress-Optical Equations
6.6 Crack Problems
6.6.1 Introduction
6.6.2 Principle of the Method6.6.3 Opening-Mode Loading
6.6.4 Mixed-Mode Loading
6.6.5 Anisotropic Materials
6.6.6 The state of Stress Near the Crack Tip
6.6.7 Comparison of the Method of Caustics with Other Optical Methods
7. Photoelasticity
7.1 Introduction
7.2 Plane Polariscope
7.3 Circular Polariscope
7.4 Isoclinics
7.5 Isochromatics
7.6 Isochromatics with White Light
7.7 Properties of Isoclinics
7.8 Properties of Isochromatics
7.9 Compensation
7.9.1 Introduction
7.9.2 The Tension/Compression Specimen
7.9.3 Babinet and Babinet-Soleil Compensators
7.9.4 Sernarmont Compensation Method
7.9.5 Tardy Compensation Method
7.10 Determination of Photoelastic constant fs
7.11 Stress Separation7.12 Fringe Multiplication and Sharpening
7.13 Transition from Model to Prototype
7.14 Three-Dimensional Photoelasticity
7.15 Photoelastic Coatings
7.15.1 Introduction
7.15.2 Transfer of Stresses From Body to Coating.
7.15.3 Determination of Stresses
7.15.4 Reinforcing Effect
7.15.5 Photoelastic Strain Gages
8. Interferometry
8.1 Introduction
8.2 Interferometric Systems
8.3 Analysis of Interferometric Systems
8.3.1 Introduction
8.3.2 The Mach-Zehnder Interferometer
8.3.3 The Michelson Interferometer
8.3.4 The Fizeau-Type Interferometer
8.3.5 Other Interferometers
8.3.6 A Generic Analysis of Interferometers
9. Holography
9.1 Introduction
9.2 Holography
9.3 Holographic Interferometry
9.3.1 Introduction
9.3.2 Real-Time Holographic Interferometry
9.3.3 Double-Exposure Holographic Interferometry
9.3.4 Sensitivity Vector
9.4 Holographic Photoelasticity
9.4.1 Introduction
9.4.2 Isochromatic-Isopachic Patterns
10. Optical Fiber Strain Sensors
10.1 Introduction
10.2 Optical Fibers
10.2.1 Introduction
10.2.2 Structure
10.2.3 Principle of operation
10.2.4 Applications
10.2.5 Advantages and disadvantages
10.3 Fiber Optic Sensors (FOS)
10.3.1 Architecture of a FOS
10.3.2 Classification of FOSs10.3.3 Interferometric Fiber Optic Sensors (FOS)
10.3.4 Fiber Bragg Grating Sensors (FBGS)
10.3.5 Multiplexing
10.3.6 Advantages and disadvantages of OFSs
10.3.7 Applications of Fiber Optic Sensors
11. Speckle Methods
11.1 Introduction
11.2 The Speckle Effect
11.3 Speckle Photography
11.3.1 Introduction
11.3.2 Point-by-Point Interrogation of the Specklegram
11.3.3 Spatial Filtering of the Specklegram
11.4 Speckle Interferometry
11.5 Shearography
11.6 Electronic Speckle Pattern Interferometry (ESPI)
12. Digital Image Correlation (DIC)
12.1 Introduction
12.2 Essential Steps of DIC
12.3 Speckle Patterning12.4 Image Digitization
12.5 Intensity Interpolation
12.6 Image Correlation – Displacement Measurement
12.7 2-D and 3-D Displacement Measurements
13. Thermoelastic Stress Analysis (TSA)
13.1 Introduction
13.2 Thermoelastic Law11.3 Infrared Detectors
13.4 Adiabaticity
13.5 Specimen Preparation13.6 Calibration
13.7 Stress Separation
13.8 Applications
14. Indentation
14.1 Introduction
14.2 Contact Mechanics
14.3 Macro-Indentation Testing
14.3.1 Brinell Test
14.3.2 Meyer Test
14.3.3 Vickers Test
14.3.4 Rockwell Test
14.4 Micro-Indentation testing
14.4.1 Vickers Test
14.4.2 Knoop Test14.5 Nanoindentation Testing
14.5.1 Introduction
14.5.2 The Elastic Contact Method
14.5.3 Nanoindentation for Measuring Fracture Toughness
15. Nondestructive Testing (NDT)
15.1 Introduction
15.2 Dye Penetrant (DPI)
15.2.1 Principle
15.2.2 Application
15.2.3 Advantages and Disadvantages
15.3 Magnetic Particles Inspection (MPI)
15.3.1 Principle
15.3.2 Advantages and Disadvantages
15.4 Eddy Currents Inspection (ECI)
15.4.1 Principle
15.4.2 Advantages and Disadvantages
15.5 X-ray Diffraction
15.5.1 Introduction
15.5.2 X-rays
15.5.3 X-ray Diffraction
15.5.4 Measurement of Strain
15.5.5 Instrumentation
15.6 Ultrasonic Testing (UT)
15.6.1 Introduction
15.6.2 Operation
15.6.3 Advantages and Disadvantages
15.7 Acoustic Emission Testing (AET)
15.7.1 Introduction
15.7.2 Acoustic Emission Testing
15.7.3 Advantages and Disadvantages
16. Residual Stresses – The Hole Drilling Method
16.1 Introduction
16.2 Hole-Drilling Method
16.3 Uniaxial Residual Stresses
16.4 Biaxial Residual Stresses
16.5 Variation of Residual Stresses Through the Thickness16.6 Nondestructive Methods for Measuring Residual Stresses
Emmanuel Gdoutos is Full Member of the Academy of Athens in the chair of Theoretical and Experimental Mechanics (2016). He is member of many academies worldwide, fellow of scientific societies and received numerous awards. His book “Fracture Mechanics – An Introduction, 3rd edition” published by Springer accompanied by a solutions manual is used as a textbook by many universities worldwide. His book “Matrix Theory of Photoelasticity” published by Springer-Verlag presents a novel and unified interpretation of the problems of photoelastic stress analysis using the modern methods of description of polarized light. He is the book series editor of the Springer series “Springerbriefs in Structural Mechanics”. His research interest include problems of the theory of elasticity, fracture mechanics, experimental mechanics (with emphasis in the optical methods), mechanics of composite materials, sandwich structures and nanotechnology (composite nanomaterials).
The book presents in a clear, simple, straightforward, novel and unified manner the most used methods of experimental mechanics of solids for the determination of displacements, strains and stresses. Emphasis is given on the principles of operation of the various methods, not in their applications to engineering problems. The book is divided into sixteen chapters which include strain gages, basic optics, geometric and interferometric moiré, optical methods (photoelasticity, interferometry, holography, caustics, speckle methods, digital image correlation), thermoelastic stress analysis, indentation, optical fibers, nondestructive testing, and residual stresses. The book will be used not only as a learning tool, but as a basis on which the researcher, the engineer, the experimentalist, the student can develop their new own ideas to promote research in experimental mechanics of solids.
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