Electromigration in Metals: Fundamentals to Nano-Interconnects

ISBN-13: 9781107032385 / Angielski / Twarda / 2022 / 400 str.

Valeriy Sukharev

Opis

Learn to assess electromigration reliability and design resilient chips, building from fundamental physics to advanced methodologies.

Recenzje

'… useful for graduate students in materials science and mechanical or electrical engineering … Recommended.' J. Lambropoulos, Choice

Spis treści

1. Introduction to electromigration; 2. Fundamentals of electromigration; 3. Thermal stress characteristics and stress induced void formation in aluminium and copper interconnects; 4. Stress evolution and damage formation in confined metal lines under electric stressing; 5. Electromigration in Cu interconnect structures; 6. Scaling effects on microstructure and resistivity of Cu and Co nanointerconnects; Analysis of electromigration induced stress evolution and voiding in Cu damascene lines with microstructure; 8. Massive scale statistical studies for electromigration; 9. Assessment of electromigration damage in large on-chip power grids. Index.