Design for Excellence C

ISBN-13: 9781119109372 / Angielski / Twarda / 2021 / 400 str.

Tulkoff, Cheryl

Spis treści

Contributors xxiiiForeword xxvPreface xxviiAcknowledgments xxixAcronyms xxxiIntroduction iii1 Introduction to Design for Excellence1.1 Design for Excellence (DfX) in Electronics Manufacturing 11.2 Chapter 2 - Establishing a Reliability Program 31.3 Chapter 3 - Design for Reliability (DfR) 31.4 Chapter 4 - Design for the Use Environment: Reliability Testingand Test Plan Development 41.5 Chapter 5 - Design for Manufacturability 51.6 Chapter 6 - Design for Life Cycle Management 61.7 Chapter 7 - Root Cause Problem-Solving, Failure Analysis, and Continual Improvement Techniques 1.8 Chapter 8 - Summary and Bringing It All Together 82 Establishing a Reliability Program2.1 Introduction 92.2 Best Practices and the Economics of a Reliability Program 122.2.1 Best in Class Reliability Program Practices 132.3 Elements of a Reliability Program 162.3.1 Reliability Goals 172.3.2 Defined Use Environments 182.3.3 Software Reliability 212.3.4 General Software Requirements 222.4 Review of Commonly Used Probability and Statistics Concepts in Reliability2.4.1 Sources of Reliability Data 322.4.2 Reliability Probability in Electronics 352.4.3 Variation Statistics 352.4.4 Reliability Statistics in Electronics 362.5 Reliability Analysis and Prediction Methods 392.6 Summary 45Bibliography 453 Design for Reliability3.1 Introduction 473.1.1 DfR at the Concept Stage 543.2 Specifications (Product and Environment Definitions and Concerns) 573.3 Reliability Physics Analysis 613.3.1 Reliability Physics Alternatives 683.3.2 Reliability Physics Models and Examples 713.3.3 Component Selection 773.3.4 Critical Components 793.3.5 Moisture Sensitivity Level 813.3.6 Temperature Sensitivity Level 813.3.7 Electrostatic Discharge 813.3.8 Lifetime 833.4 Surviving the Heat Wave 853.5 Redundancy 893.6 Plating Materials - Tin Whiskers 913.7 Derating and Uprating 943.8 Reliability of New Packaging Technologies 963.9 Printed Circuit Boards 983.9.1 Surface Finishes 993.9.2 Laminate Selection 1073.9.3 Cracking and Delamination 1083.9.4 Plated Through Holes- Vias 1093.9.5 Conductive Anodic Filament 1123.9.6 Strain and Flexure Issues 1163.9.7 Pad Cratering 1193.9.8 PCB Buckling 1203.9.9 Electrochemical Migration 1213.9.10 Cleanliness 1343.10 Non-Functional Pads 1383.11 Wearout Mechanisms 1393.12 Conformal Coating and Potting 143Bibliography 1504 Design for the Use Environment: Reliability Testing and TestPlan Development4.1 Introduction 1554.1.1 Elements of a Testing Program 1574.1.2 Know The Environment 1624.2 Standards and Measurements 1644.3 Failure Inducing Stressors 1654.4 Common Test Types 1664.4.1 Temperature Cycling 1664.4.2 Temperature-Humidity-Bias Testing 1684.4.3 Electrical Connection 1694.4.4 Corrosion Tests 1694.4.5 Power Cycling 1704.4.6 Electrical Loads 1704.4.7 Mechanical Bending 1714.4.8 Random and Sinusoidal Vibration 1724.4.9 Mechanical Shock 1764.4.10 ALT Testing 1784.4.11 HALT Testing 1784.4.12 EMC Testing Dos and Don'ts 1814.5 Test Plan Development 1824.5.1 The Process 1844.5.2 Failure Analysis 1864.5.3 Screening Tests 1864.5.4 Case Study 1 1894.5.5 Case Study 2 1924.5.6 Case Study 3 195Bibliography 1985 Design for Manufacturability (DfM)5.1 Introduction 2015.2 Overview of Industry Standard Organizations 2075.3 Overview of DfM Processes 2125.4 Component Topics 2155.5 Printed Circuit Board Topics 2345.5.1 Laminate Selection 2345.5.2 Surface Finish 2355.5.3 Discussion of Different Surface Finishes 2365.5.4 Stack-up 2405.5.5 Plated Through Holes 2425.5.6 Conductive Anodic Filament (CAF) Formation 2435.5.7 Copper Weight 2445.5.8 Pad Geometries 2455.5.9 Trace and Space Separation 2475.5.10 Non-Functional Pads 2485.5.11 Shipping and Handling 2485.5.12 Cleanliness and Contamination 2495.6 Process Materials 2535.6.1 Solder 2535.6.2 Solder Paste 2545.6.3 Flux 2555.6.4 Stencils 2585.6.5 Conformal Coating 2595.6.6 Potting 2645.6.7 Underfill 2665.6.8 Cleaning Materials 2675.6.9 Adhesives 2675.7 Summary: Implementing DfM 268Bibliography 2696 Design for Life Cycle Management6.1 Introduction 2716.2 Obsolescence Management 2726.2.1 Obsolescence Resolution Techniques 2736.2.2 Industry Standards 2766.2.3 Asset Security 2786.3 Long-Term Storage 2806.4 Long-Term Reliability Issues 2836.5 Counterfeit Prevention and Detection Strategies 2886.6 Supplier Selection 3066.6.1 Selecting a Printed Circuit Board Fabricator 3096.6.2 Auditing a Printed Circuit Board Fabricator 3186.6.3 Selecting a Contract Manufacturer 3326.6.4 Auditing a Contract Manufacturer 3366.6.5 Summary 3427 Root Cause Problem-solving, Failure Analysis and Continual Improvement Techniques7.1 Introduction 3457.1.1 Continual Improvement 3477.1.2 Problem-Solving 3487.1.3 Identification of Problems and Improvement Opportunities 3487.1.4 Overview of Industry Standard Organizations 3527.2 Root Cause Failure Analysis Methodology 3577.3 Failure Reporting, Analysis and Corrective Action System (FRACAS)7.4 Failure Analysis (FA) 3737.4.1 Failure Analysis Techniques 3767.4.2 Failure Verification 3997.4.3 Corrective Action 4007.4.4 Failure Report Closure 4017.5 Continuing Education and Improvement Activities 4027.6 Summary: Implementing Root Cause Methodology 403Bibliography 4048 Conclusion to Design for Excellence: Bringing It All Together8.1 Design for Excellence (DfX) in Electronics Manufacturing 4078.2 Chapter 2 - Establishing a Reliability Program 4088.3 Chapter 3 - Design for Reliability (DfR) 4098.4 Chapter 4 - Design for the Use Environment: Reliability Testing and Test Plan Development8.5 Chapter 5 - Design for Manufacturability 4138.6 Chapter 6 - Design for Life Cycle Management 4168.7 Chapter 7 - Root Cause Problem Solving, Failure Analysis, andContinual Improvement Techniques 418Index 421

O autorze

CHERYL TULKOFF is Director of Corporate Quality at National Instruments, Texas, USA. She has over 22 years of experience in electronics manufacturing focusing on failure analysis and reliability. She's passionate about accelerating product design and development while improving reliability, optimizing resources, and improving customer satisfaction.GREG CASWELL is a Senior Member of the Technical Staff, DfR Solutions. He has over 50 years of experience in the microelectronics industry. His experience encompasses all aspects of SMT manufacturing, circuit board fabrication, advanced packaging, IC fabrication processes and materials, solder reflow, and RoHS.