Creep in Ceramics

ISBN-13: 9783319508252 / Angielski / Twarda / 2017 / 445 str.

Joshua Pelleg

Opis

This textbook is one of its kind, since there are no other books on Creep in Ceramics. The book consist of two parts. In part A general knowledge of creep in ceramics is considered, while part B specifies creep in technologically important ceramics, namely creep in oxide ceramics, carnides and nitrides. While covering all relevant information regarding raw materials and characterization of creep in ceramics, the book also summarizes most recent innovations and developments in this field as a result of extensive literature search.

Spis treści

Part A: Basics.- Chapter 1. What is Creep?.- Chapter 2. General Mechanisms of Creep.- Chapter 3. Creep and its Relation to Diffusion.- Chapter 4. Creep in Ceramics.- Chapter 5. Testing Methods for Creep.- Chapter 6. Creep in Nanoceramics.- Chapter 7. Creep Rupture.- Chapter 8. Superplasticity.- Chapter 9. Creep and Recovery.- Chapter 10. Empirical Relations.- Chapter 11. Design for Creep Resistance.- Part B. Creep in Technologically Important Ceramics.- Chapter 12. Creep in Alumina (Al₂O₃).- Chapter 13. Creep in Magnesia (MgO).- Chapter 14. Creep in Zirconia (ZrO2).- Chapter 15. Creep in Silicon Carbide (SiC).- Chapter 16. Creep in Boron Carbide (BC).- Chapter 17. Creep in Silicon Nitride (Si₃N₄).

O autorze

Joshua Pelleg received his B.S. in Chemical Engineering Technion Institute of Technology, Haifa, Israel, M. S. in Metallurgy, Illinois Institute of Technology, Chicago, IL, USA and Ph. D. in Metallurgy, University of Wisconsin, Madison, WI. He is with Ben Gurion University of the Negev, Materials Engineering Department, Beer Sheva, Israel since 1970, was among the founders of the department, and its second chairman. Professor Pelleg was the recipient of the Sam Ayrton Chair in Metallurgy. He has taught ever since the subjects of Mechanical Properties of Materials, Diffusion in Solids and Defects in Solids. He has chaired several University committees and served four terms as the Chairman of Advanced Studies in Ben Gurion University. Prior to arriving to BGU, Pelleg acted as Assistant Professor and then Associate Professor in the Department of Materials and Metallurgy, University of Kansas, Lawrence, KS, USA. Professor Pelleg was Visiting Professor in: Department of Metallurgy, Iowa State University, Institute for Atomic Research, US Atomic Energy Commission, Ames, IA, USA, McGill University, Montreal, QC, Canada, Tokyo Institute of Technology, Applied Electronics Dept., Nagatsuta Campus, Yokohama, Japan and in Curtin University, Department of Physics, Perth, Australia. Among his non-academic research and industrial experience one can note: Chief Metallurgist in Urdan Metallurgical Works LTD., Netanya, Israel, Research Engineer in International Harvester, Manufacturing Research, Chicago IL., Associate Research Officer, National Research Council of Canada, Structures and Materials, National Aeronautical Establishment, Ottawa, ON, Physics Senior Research Scientist, Nuclear Research Center, Beer Sheva, Israel. Materials Science Division, Argonne National Labs, Argonne, IL, USA., Atomic Energy of Canada, Chalk River, Ont. Canada, Visiting Scientist, CSIR, National Accelerator Centre, Van de Graaf Group Faure, South Africa, Bell Laboratories, Murray Hill, NJ, USA, GTE Laboratories, Waltham, MA, USA. His current research interests are diffusion in solids, thin film deposition and properties (mostly by sputtering) and characterization of thin films among them various silicides.

The previous book of this author, Mechanical Properties of Ceramics, won a Texty award in 2015.

Blurb

This book focuses on Creep in Ceramics. The book consists of two parts. In part A general knowledge of creep in ceramics is considered, while part B specifies creep in technologically important ceramics, namely creep in oxide ceramics, carnides and nitrides. While covering all relevant information regarding raw materials and characterization of creep in ceramics, the book also summarizes most recent innovations and developments in this field as a result of extensive literature search.